Sumitomo Chemical Company, Limited

Yasurou Suzuki

Takashi Sanada

Hiroomi Abe

Taichi Nishio

Mitsuji Tsuji

Kenji Nagaoka

Kuniaki Asai

Teruo Saito

Kaoru Kitadono

Noriyasu Kagawa

Masahiro Kakugo

Takayuki Okada

Satoru Hosoda

Hiroshi Hagimori

Takeshi Sanada

Etsuji Okumura

A thermoplastic resin composition superior in impact resistance, heat resistance, flexural rigidity, processability and solvent resistance which comprises: (A) 100 parts by weight of a resin composition comprising 5-95% by weight of a polyphenylene ether, or a polyphenylene ether and polystyrene, and 95-5% by weight of a polyamide resin; (B) 5-50 parts by weight of a modified saturated rubber obtained by grafting 5-100 parts by weight of an aromatic vinyl compound on 100 parts by weight of a saturated type rubber and allowing 0.05-10 parts by weight of a compatibilizing agent to react with said rubber; and (c) 0.05-20 parts by weight of a compatibilizing agent.

Thermoplastic resin composition

A resin composition having improved resistance to discoloration by sunlight comprising (A) a polymer mixture which comprises a polyphenylene ether, a polyamide and optionally a polystyrene and/or an agent to improve the impact resistance, and (B) an inorganic powder whose mean particle size is less than or equql to 5 micrometer, in an amount of more than or equal to 15 parts by weight based on 100 parts by weight of the polyphenylene ether in the polymer mixture (A), which is selected from the group consisting of titanium oxide, mica coated with titanium oxide, barium sulphate, zinc oxide and zinc sulfide.

Thermoplastic resin composition having improved resistance to

A thermoplastic resin composition comprises a polyphenylene ether having a reduced viscosity within the range of 0.30 dl/g or more and less than 0.45 dl/g, an aliphatic polyamide, a specified compatibilizing agent, and a rubber material. The composition has a high in heat distortion temperature and is superior in processability.

A process for making a thermoplastic resin composition which comprises a melting and mixing 100 parts by weight of polyphenylene ether (A) and 0.01-5.0 parts by weight of at least one compound (B) which contains in its molecule both (a) carbon-carbon double bond or carbon-carbon triple bond and (b) carboxyl group, acid anhydride group, acid amide group, imide group, carboxylic acid ester group, epoxy group, amino group or hydroxyl group in the presence of 0.01% or more and less than 0.1% by weight of radical initiator based on the polyphenylene ether (A),

Process for making a thermoplastic resin composition

Disclosed is a thermoplastic resin composition improved in low-temperature impact resistance and processability which comprises:

A novel thermoplastic composition having improved paint adhesion strength and excellent impact strength comprising,

(A) 10-70 parts by weight of a polyphenylene ether, a mixture of a polyphenylene ether and a polystyrene or a polyphenylene ether-styrene graft copolymer, (B) 90-30 parts by weight of a mixture of (i) a thermoplastic aromatic copolyamide and/or an aromatic nuclear-hydrogenated copolyamide in an amount of 0.1-70% by weight of existing total polyamide and (ii) a thermoplastic aliphatic polyamide in a complementary amount of 99.9-30% by weight of existing total polyamide, and (C) 0.01-30 parts by weight, based on 100 parts by weight of the above components (A) and (B) of, at least one compound selected from the group consisting of oxazoline and a compound having, in its molecule, (a) carbon-carbon double bond or a carbon-carbon triple bond and (b) at least one functional group selected from carboxyl group, acid anhydride group, amino group, acid amide group, imido group, epoxy group, carboxylate ester group, isocyanate group, methylol group, oxazolidine group and hydroxyl group. This composition may further contain an impact strength modifier, namely, rubber-like material and/or modified rubber-like material.

A process for making a thermoplastic resin composition which comprises melting and mixing 100 parts by weight of polyphenylene ether (A) and 0.01-5.0 parts by weight of at least one compound (B) which contains in its molecule both (a) carbon-carbon double bond or carbon-carbon triple bond and (b) carboxyl group, acid anhydride group, acid amide group, imide group, carboxylic acid ester group, epoxy group, amino group or hydroxyl group in the presence of 0.01% or more and less than 0.1% by weight of radical initiator based on the polyphenylene ether (A),

A novel thermoplastic resin composition comprising a matrix of polyamide resin (E) and a disperse phase of a composition (D), said composition (D) comprising a polyphenylene ether (A), a rubber-like materail (B) and a mutual compatibilizer (C), said polyphenylene ether (A) being obtained from at least one phenol compound represented by the formula: ##STR1## wherein R.sub.1, R.sub.2, R.sub.3, R.sub.4 and R.sub.5 represents a hydrogen atom, a halogen atom or a substituted or unsubstituted hydrocarbon residue, with a proviso that at least one of them is a hydrogen atom, and said polyphenylene ether (A) having a reduced viscosity .eta..sub.sp/c of 0.40-0.58 deciliter/gram, said mutual compatibilizer (C) being compatible or reactive with said polyphenylene ether and reactive with said polyamide resin, and said polyamide resin (E) having a number average molecular weight of 14,000-40,000 and an end amino group content of 50-95 mmole/kg, wherein the thermoplastic resin composition constitutes 1-65 wt. % of said polyphenylene ether (A), 1-20 wt. % of said rubber-like material (B), 0.01-5 wt. % of said mutual compatibilizer (C) and 35-97.99 wt. % of said polyamide resin (E), based on the total weight of said thermoplastic resin composition, and the weight average particle size of said disperse phase is 2 micron or less.

A thermoplastic resin composition which comprises

A wire coating resin composition comprising 25 to 95% by weight of a polyetherketone and 75 to 5% by weight of an aromatic polysulfone, which is characterized by the intrinsic viscosity (y) of the polyetherketone complying with the condition

Wire coating resin composition

A thermoplastic resin composition comprising a resin blend comprising an aromatic polysulfone and a polyetherketone, the relationship between the blending ratio and the melt viscosity of said polyetherketone satisfying a specific mathematical expression, and one or more inorganic fillers having a specific shape is disclosed. The thermoplastic resin composition according to the present invention provides many property advantages including chemical resistance and injection molding stability. It can be suitably used in the frontier industries such as electric, electronic, automobile and office automation instrument industries.

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Chiba, Japan

Yasurou Suzuki