Denso Corporation

Yasuo Tsuzuki

Noboru Nagase

Koji Ando

An ignition coil has a stress absorbing member with a coefficient of linear expansion which is smaller than a coefficient of linear expansion of a potting resin. The stress absorbing member faces along a circuit element of a mold ignition circuit and is buried in the potting resin. Thus, stress, caused by temperature change, which is applied to the circuit element of the mold ignition circuit from the potting resin can be reduced by the stress absorbing member. Therefore, peeling at a bonding portion of the circuit elements or at the crack can be prevented. Furthermore, the stress absorbing member is only facing along the circuit element mounting surface, and the mold ignition circuit is not wrapped by the stress absorbing member. Therefore, heat radiation from the mold ignition circuit is not suppressed by the stress absorbing member. The radiation performance of the ignition apparatus is thus improved, and the durability and credibility of the ignition circuit is improved.

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Chita-gun, Japan

Yasuo Tsuzuki