Shimadzu Corporation

Ebara Corporation

Other

Yasuo Tsukuda

Yoichi Kobayashi

Shunsuke Nakai

Hitoshi Tsuji

Hiroki Yamauchi

Kazunari Shinya

Junki Ishimoto

Kazuto Hirokawa

Shinrou Ohta

Osamu Ando

Shinro Ohta

Hideki Sato

Atsuhiro Iida

Shin-ichi Kuroda

Kan Nakamura

Yoichi; c/o Ebara Corporation Kobayashi

Hitoshi; c/o Ebara Corporation Tsuji

Kazuto c/o Ebara Corporation Hirokawa

Shunsuke c/o Ebara Corporation Nakai

Yoichi c/o Ebara Corporation Kobayashi

Shinrou c/o Ebara Corporation Ohta

Shunsuke; c/o Ebara Corporation Nakai

A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring apparatus includes a light-emitting unit for applying light from a light source to a surface of a workpiece being polished, a light-receiving unit for receiving reflected light from the surface of the workpiece, a spectroscope unit for dividing the reflected light received by the light-receiving unit into a plurality of light rays having respective wavelengths, and light-receiving elements for accumulating the detected light rays as electrical information. The polishing state monitoring apparatus further includes a spectral data generator for reading the electrical information accumulated by the light-receiving elements and generating spectral data of the reflected light, and a processor for calculating a predetermined characteristic value on the surface of the workpiece based on the spectral data generated by the spectral data generator.

Polishing state monitoring method

A liquid sample is dropped onto the upper surface of a transparent and cylindrical light-transmitting body (), and the liquid sample is maintained as a droplet by the surface tension. From above the liquid sample, a transparent cover plate () is lowered down to the position where the lower surface thereof touches a spacer () in order that the liquid sample is held in the small gap formed between the upper surface of the light-transmitting body () and the lower surface of the transparent cover plate (). A measurement light is provided into the liquid sample held in this manner from immediately above it, and passes through the liquid sample. The transmitted light emitted downwards through the light-transmitting body () is introduced into a spectro-detecting unit to be spectro-measured. The measurement optical path length can be adjusted by the height of the spacer (). This enables an easy transmission spectro-measurement of an extremely small amount of liquid sample.

Spectrophotometer

In a spectrophotometer for measuring transmitted light of a trace liquid sample, four sample holdersare provided on a disk-like sample platewhile spaced apart by 90 degrees. The sample plateis driven to rotate so that each of the sample holdersis sequentially moved to a sample supply position U, a measuring position U, a wiping position Uand a waiting position U. At the sample supply position U, a trace amount of the liquid sample is dropped into a groove of the sample holder. Then at the measuring position U, a window plateis lowered onto the groove so as to determine the optical path length. Next, measurement of the transmitted light is performed. Further, while the sample holdermoves from the measuring position Uto the waiting position U, the liquid sample is absorbed and removed by contact with a cleaning pad. The liquid sample attached to the window plateis wiped out by another pad. Since the operation to wipe off the measured sample is automatically performed, it is possible to improve the throughput of the measurement.

Optical measurement device for trace liquid sample

Polishing state monitoring apparatus and polishing apparatus

A substrate polishing apparatus for polishing a polishing surface of a substrate has a film thickness monitoring device for monitoring a state of a film thickness of a thin film on the polishing surface of the substrate during polishing. The apparatus includes a table, a polishing member fixed on a surface of the table, a substrate support member for pressing the substrate onto the polishing member, an optical system composed of an optical fiber for irradiating the polishing surface of the substrate with a light of irradiation and an optical fiber for receiving a reflected light reflected on the polishing surface of the substrate, an analysis-processing system for processing an analysis of the reflected light received with the optical system, and the film-thickness monitoring device. The table is provided with a liquid-feeding opening for feeding a translucent liquid into a through-hole disposed in the polishing member.

Substrate polishing apparatus

Disclosed is a spectrophotometry for a spectral transmission measurement of an extremely small volume of sample solution. A sampleris formed of a flat plate member formed with a sample-holding holewhich penetrates the flat plate member in its thickness direction and has a reverse truncated cone shape, and a target sample solution is dropped into the sample-holding holeof the samplerpositioned approximately horizontally and held in the holebased on a surface tension of the sample solution in the form of a droplet S. Then, a measurement light is emitted to the held droplet S from directly above. A transmitted light getting out of the droplet S downward is introduced to a diffraction gratingthrough a window plateand a slit, and dispersed in a wavelength dependent manner. The resulting light with dispersed wavelength components is detected by a multichannel detectorapproximately simultaneously.

Spectrophotometric method and apparatus

A substrate polishing apparatus polishes a substrate to a flat mirror finish. The substrate polishing apparatus has a polishing table against which a substrate is pressed, a light-emitting and light-receiving device to emit measurement light from the polishing table to the substrate and to receive reflected light from the substrate for measuring a film on the substrate, a fluid supply passage for supplying a measurement fluid, through which the measurement light and the reflected light pass, to a fluid chamber provided at a light-emitting and light-receiving position of the polishing table, and a fluid supply control device for controlling supply of the measurement fluid to the fluid chamber.

Polishing state monitoring apparatus and polishing apparatus and method

A substrate polishing apparatus polishes a substrate such as a semiconductor wafer to a flat mirror finish. The substrate polishing apparatus has a polishing table against which a substrate is pressed and a light-emitting and light-receiving device to emit measurement light from the polishing table to the substrate and to receive reflected light from the substrate for measuring a film on the substrate. The substrate polishing apparatus also has a fluid supply passage for supplying a fluid for measurement, through which the measurement light and the reflected light pass, to a fluid chamber provided at a light-emitting and light-receiving position of the polishing table, and a fluid supply control device for controlling supply of the fluid for measurement to the fluid chamber.

The substrate polishing apparatus for polishing a polishing surface of a substrate comprises a film thickness monitoring device for monitoring a state of a film thickness of a thin film on the polishing surface of the substrate during polishing. The apparatus includes a table, a polishing member fixed on a surface of the table, a substrate support member for pressing the substrate onto the polishing member, an optical system composed of an optical fiber for irradiating the polishing surface of the substrate with a light of irradiation and an optical fiber for receiving a reflected light reflected on the polishing surface of the substrate, an analysis-processing system for processing an analysis of the reflected light received with the optical system, and the film-thickness monitoring device. The table is provided with a liquid-feeding opening for feeding a translucent liquid into a through-hole disposed in the polishing member.

The substrate polishing apparatus for polishing a polishing surface of a substrate comprises a film thickness monitoring device for monitoring a state of a film thickness of a thin film on the polishing surface of the substrate during polishing. The apparatus includes a table, a polishing member fixed on a surface of the table, a substrate support member for pressing the substrate onto the polishing member, an optical system composed of an optical fiber for irradiating the polishing surface of the substrate with a light of irradiation and an optical fiber for receiving a reflected light reflected on the polishing surface of the substrate, an analysis-processing system for processing an analysis of the reflected light received with the optical system, and the film-thickness monitoring device, wherein the table is provided with a liquid-feeding opening for feeding a translucent liquid into a through-hole disposed in the polishing member.

An infrared light source used in spectrometers including an infrared range, a Fourier Transform Infrared Spectroscope (FTIR), etc. The infrared light source is composed of a panel made of sintered silicon nitride plates, a heating element made of metal and embedded in the panel, and a pair of conducting lines for supplying electricity to the heating element. The infrared light is emitted homogeneously from the flat surface of the panel, as compared to a conventional infrared light source using a metal filament in which infrared light is emitted inhomogeneously. It is preferred to form a silicon oxide layer on a surface of the panel to prevent initial change in the infrared emitting characteristic.

Growing community of inventors

Osaka, Japan

Yasuo Tsukuda