Sumitomo Bakelite Company Limited

Yasuo Shimobe

Ryuichi Murayama

Sumio Shibahara

Hiromitsu Kuramoto

Koji Makihara

Keiji Mitote

Keiichiro Saitoh

A paste-like adhesive composition of the present invention contains metal particles (A) and a thermally polymerizable compound (B), in which the metal particles (A) form a particle coupling structure by causing sintering through a thermal treatment; when dynamic viscoelasticity of the composition is measured under a condition of a measurement frequency of 1 Hz, within a temperature region of 140&#xb0; C. to 180&#xb0; C., the composition has a temperature width of equal to or larger than 10&#xb0; C. in which a shear modulus of elasticity is equal to or higher than 5,000 Pa and equal to or lower than 100,000 Pa; and an acetone insoluble fraction of a sample, which is obtained by removing the metal particles (A) and then heating the composition under conditions of 180&#xb0; C. and 2 hours, is equal to or lower than 5% by weight.

Paste-like adhesive composition, semiconductor device, method for manufacturing semiconductor device, and method for bonding heatsink

According to the present invention, a semiconductor having excellent yield is provided. The semiconductor device () of the present invention includes:

Semiconductor device

A transparent composite composition is provided which is low in coefficient of linear expansion and excellent in transparency, heat resistance and solvent resistance and can serve as an optical sheet for a liquid crystal display device or organic EL display device, for instance and can thus serve as a glass substitute. The transparent composite composition has a transparent resin (a) and a glass filler (b), and the transparent resin (a) is a copolymer obtained from at least one reactive monomer lower in refractive index than the glass filler (b) and at least one reactive monomer higher in refractive index than the glass filler (b).

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Tokyo, Japan

Yasuo Shimobe