Mitsubishi Denki Kabushiki Kaisha

Nippon Steel Corporation

Yasuo Shiinoki

Haruo Komoto

Shigeharu Hamada

Hiroo Goshi

Michio Sato

Katsumi Nagano

An apparatus for automatically maintaining plating current density within a predetermined range while controlling plating current to produce a desired plating thickness includes means for energizing only the number of plating cells required to maintain plating current density within the predetermined range. The total plating current required to produce the desired plating thickness is distributed among the energized plating cells. Decreases in the number of energized plating cells is made at speed values which are less by a hysteresis value than speeds at which the number of energized plating cells is increased to avoid instability due to normal speed reading variations.

Plating current automatic compensating apparatus

An apparatus in which plating currents of a plurality of successive plating cells are normally automatically controlled in accordance with line speed to maintain uniform plating thickness, and in which the number of energized plating cells is increased or decreased in accordance with line speed to maintain plating current density within a predetermined range, includes tracking or timing facilities for progressively changing plating currents of plating cells in correspondence with movement of the strip being plated through the cells after the number of energized cells has been increased or decreased so as to reduce plating thickness variation on the portion of the strip within the plating cells at the time of the change in the number of energized cells.

Growing community of inventors

Hyogo, Japan

Yasuo Shiinoki