Nihon Dempa Kogyo Co., Ltd.

Yasuo Sakaba

Masakazu Nishiwaki

Masashi Sato

Seiji Oda

Hiroshi Uehara

Susumu Negishi

Tatsunobu Shibuya

Xinglong Gong

There are disclosed a surface mount crystal oscillator which can enhance a product quality and improve productivity while realizing miniaturization and a manufacturing method of the crystal oscillator. On wall faces of through holes formed in corner portions of a rectangular ceramic base, through terminals are formed; on the front surface of the ceramic base, leading terminals of crystal holding terminals which hold a crystal piece are connected to the diagonal through terminals; on the back surface of the ceramic base, mount terminals connected to the through terminals are formed; and an insulating film projected especially in a corner portion direction is formed at such a position as to face the opening end face of a metal cover.

Surface mount crystal oscillator and manufacturing method of the same

There are disclosed a surface mount crystal oscillator which can enhance a product quality and improve productivity while realizing miniaturization and a manufacturing method of the crystal oscillator. On wall faces of through holes formed in corner portions of a rectangular ceramic base, through terminals are formed; on the front surface of the ceramic base, leading terminals of crystal holding terminals which hold a crystal piece are connected to the diagonal through terminals; and on the back surface of the ceramic base, mount terminals connected to the through terminals are formed in the surface mount crystal oscillator.

A method of manufacturing a surface mounted (crystal) device comprising: the steps of providing an aggregated sheet material having a plurality of container main bodies lengthwise and crosswise, accommodating at least a crystal piece inside the concavities of the plurality of container main bodies formed in the aggregated sheet material, and then parting the aggregated sheet material into individual container main bodies. The method further includes: the steps of providing annular grooves on outer perimeters between the container main bodies of the aggregated sheet material; positioning an outer peripheral edge of an electrode roller having an inclined face of a seam welder inside the annular groove; abutting the inclined face against a metal cover tacked to the container main body; bonding the metal cover to an aperture end face of the container main body, by seam welding; and then parting the aggregated sheet material into individual container main bodies.

Method for manufacturing a surface mounted crystal device

A method of manufacturing a mounting substrate accommodating therein an electronic component for use in a surface mount crystal oscillator and adapted to be joined to a bottom surface of a crystal unit has the steps of defining a recess with a bottom wall and a frame wall having an opening, placing the electronic component in the recess, filling the recess with a resin for protecting the electronic component, and, after the resin is cured, removing at least a portion of the frame wall. The electronic component typically comprises an IC (Integrated Circuit) chip incorporating an integrated oscillating circuit that employs a crystal unit.

Method of manufacturing mounting substrate and surface mount crystal oscillator

There is provided a crystal oscillator in which a crystal blank and an integrated circuit (IC) chip are accommodated in a vessel and the IC chip is fixed through a bump to the bottom surface of the vessel by means of ultrasonic thermocompression bonding. The IC chip contains an oscillation circuit utilizing the crystal blank and has a plurality of terminal electrodes on a major surface thereof. A plurality of connection terminal portions are formed on the bottom surface of the concave portion of the vessel so that each of the connection terminal portions corresponds to one of the terminal electrodes. Each of the connection terminal portions is formed into a rectangular shape and the width of each connection terminal portion is identical. The terminal electrodes and the connection terminal portions are bonded to each other through a bump by means of ultrasonic thermocompression bonding. Thus, the IC chip is fixed to the bottom surface of the concave portion of the vessel.

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Saitama, Japan

Yasuo Sakaba