Rohm & Haas Electronic Materials LLC

Shipley Company LLC

Yasuo Ohta

Motoya Shimazu

Yasushi Takizawa

Michael P Toben

James L Martin

Kazuyuki Suda

Haruki Enomoto

Fai Lung Ting

Masaaki Imanari

An additive obtained from the reaction product obtained by reacting glutaraldehyde and at least one type of compound selected from hydrocarbon compounds containing a hydroxyl group, and at least one type of compound selected from amine compounds, as well as a tin or tin alloy plating solution containing this additive.

Tin or tin alloy electroplating solution

Electroless gold plating baths and plating methods using these baths are provided. The electroless gold plating bath includes i) water-soluble gold compound, ii) complexing agent that stabilizes gold ions in the plating bath, but does not cause substantial dissolution of nickel, cobalt or palladium in the plating bath, and iii) a polyethyleneimine compound. When a material to be plated is subjected to such a gold plating bath, corrosion of the base metal under the surface of the material to be plated is reduced by controlling the substitution reaction rate immediately after initiation of the reaction, and adhesion between the base metal and deposited gold coating is increased.

Electroless gold plating bath and method

Electrolyte compositions useful for forming gold coatings on nickel containing substrates are disclosed. Also disclosed are methods of plating gold layers on nickel containing substrates.

Electroless gold plating solution and process

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Tokyo, Japan

Yasuo Ohta