Hitachi Chemical Company, Ltd.

Hitachi, Ltd.

Fuji Fiber Glass Co., Ltd.

Yasuo Miyadera

Masami Yusa

Shinji Takeda

Takashi Masuko

Akira Kageyama

Iwao Maekawa

Aizou Kaneda

Tooru Kikuchi

Mitsuo Yamasaki

Atsushi Fujioka

Hidekazu Matsuura

Tomio Fukuda

Isao Tsukagoshi

Daisuke Makino

Yasushi Gotou

Toshihiko Kato

Nobuo Miyadera

Tetsuo Kumazawa

Mitsuo Yamazaki

Katsuji Shibata

Takayuki Suzuki

Masatoshi Yoshida

Makoto Saitou

Akio Kotato

Masashi Tanaka

Tadaji Satou

Kaori Ikeda

Yoshihide Iwasaki

Mituo Yamasaki

Yuusuke Miyamae

Takashi Yokoyama

Hitoshi Yokono

Hiroshi Suzuki

Kunihiro Ichimura

Akio Nishikawa

Yoshiaki Wakashima

Mitsumasa Kojima

Ritsuro Tada

Hidetaka Satou

Iwao Fukuchi

Naoto Ohta

Masami Arai

Ikuo Hoshi

Hiroaki Doi

Tatsuya Uchida

Yutaka Honda

Kenji Tonoki

Yasuo Yamamoto

Nobuhiko Shito

Masahiro Kawakami

Hideyuki Hashimoto

Perminder Singh Johar

Yoshika Sekine

Takayuki Senda

Hiroyuki Kawada

Seiki Harada

Atsushi Saiki

Doi Hiroaki

Tadashi Nagai

Kiyoshi Yokochi

Takehisa Nakagawa

Hidekazu Matuura

A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250&#xb0; C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.

Semiconductor device and process for fabrication thereof

The present invention relates to a method for connecting electrodes comprising: interposing the polyphthalide represented by the formula (I):  

Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structure

An adhesive film including a reactive adhesive capable of curing by heating or light irradiation and a polyphthalide represented by the formula I: wherein R represents a divalent aromatic hydrocarbon group or a divalent heteroring-containing aromatic group, Rrepresents an alkyl group, a Fluorinated alkyl group, an alkoxy group or a halogen atom, where the number of Ris 0 to 4, X represents O or N&#x2014;R, provided that Rrepresents one of the following groups, Y represents SOor CO and n represents a number of repeating units in the polymer. The adhesive film can be used to connect, e.g., electrodes of a semiconductor chip to electrodes of a wiring board. The polyphthalide can be used to surface-treat, e.g., electrodes of a wiring board.

Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device

A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 Mpa or less at a temperature of 259&deg; C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.

Laminating method of film-shaped organic die-bonding material,

Liquid-crystal alignment film

Environment purifying material

An electrically conductive bonding film useful in bonding an IC or LSI with a lead frame. The film comprises (A) a polyimide resin obtained by reacting a tetracarboxylic dianhydride component, in which the content of a tetracarboxylic dianhydride represented by the following formula (I): ##STR1## wherein n stands for an integer of 2-20 amounts to at least 70 mole %, with a diamine; and (B) an electrically conductive filler. Optionally, the film may further comprises a thermosetting resin or an imide compound having at least two thermally-crosslinking imido groups per molecule.

Electrically conductive bonding films

Growing community of inventors

Tsukuba, Japan

Yasuo Miyadera