Nec Corporation

Alps Electric Co., Ltd.

Sumitomo Bakelite Company Limited

Yasuo Matsui

Masatoshi Iji

Yukihiro Kiuchi

Isao Katayama

Katsushi Terajima

Ken Oota

Shunji Araki

There is provided a method of manufacturing a circuit board having a first fixed contact and a second fixed contact that extend substantially orthogonal to each other on the same surface, the life span required for the first fixed contact being longer than that required for the second fixed contact. The method includes: etching a copper foil formed on the entire surface of an insulating substrate to form the patterns of the first and second fixed contacts; polishing the surface of the insulating substrate with buff to remove an oxide film adhered to the copper foil; and sequentially forming a nickel layer having a thickness of about 1 to about 5 &#x3bc;m and a gold layer having a thickness of about 0.01 to about 0.5 &#x3bc;m on each of the first and second fixed contacts. In the method, the buffing direction is substantially aligned with a direction in which a first movable contact slides on the first fixed contact.

Method of manufacturing circuit board used for switch device

An epoxy resin composition which can be used as a semiconductor encapsulating resin and in which the improvement of flame retardancy can be attained by suitably adapting a crosslinked structure itself of a cured article without using any flame retardant material and without particularly highly filling an inorganic filler. The epoxy resin composition includes an epoxy resin (A), a phenolic resin (B), an inorganic filler (C) and a curing accelerator (D), wherein a flexural modulus E (kgf/mm) at 240&#xb1;20% C of a cured article obtained by curing the composition is a value satisfying 0.015 W+4.1&#x2266;E&#x2266;0.27 W+21.8 in the case of 30&#x2266;W&#x3c;60, or a value satisfying 0.30 W&#x2212;13&#x2266;E&#x2266;3.7 W&#x2212;184 in the case of 60&#x2266;W&#x2266;95 wherein W (wt %) is a content of the inorganic filler (C) in the cured article. The cured article of this composition forms a foamed layer during thermal decomposition or at ignition to exert flame retardancy.

Composition of biphenyl epoxy resin, phenolbiphenylaralkyl resin and filler

Flame-retardant epoxy resin composition and semiconductor device made using the same

A push-button switch affording a clear click feeling, comprising a contact plate which is curved in one direction and which is formed into a movable contact by providing therein two substantially parallel slits extending in a perimetric direction, forming a movable contact portion between said two slits, and curving both side edges of said contact plate along said slits oppositely to the direction of the curvature of said movable contact portion so as to form normally-contacted contact portion; a switch body which includes first stationary contacts and a second stationary contact; and a push button; said normally-contacted contact portions of said contact plate being normally held in electrical contact with said first stationary contacts of said switch body, while said movable contact portion of said contact plate is depressed and deformed oppositely to the direction of the curvature thereof by said push button, thereby to come into electrical contact with said second stationary contact of said switch body; said contact plate including both-end joint portions which join said movable contact portion and said normally-contacted contact portions integrally, a pair of bent line portions being formed between said each joint portion and said normally-contacted contact portions, said each bent line portion defining an acute angle with respect to the slit.

Snap action push button switch

Growing community of inventors

Tokyo, Japan

Yasuo Matsui