Tokyo Ohka Kogyo Co., Ltd.

Yasuo Masuda

Toshiki Okui

Toshimasa Nakayama

Hidekatsu Kohara

Koji Saito

Atsushi Sawano

Yasushi Washio

Yasushi Kuroiwa

Shinichi Kono

Hayato Ohno

A chemically amplified positive-type photosensitive resin composition that can be well developed with an aqueous basic solution having low pH, a substrate with a photosensitive film formed from the composition, and a method for patterned resist film formation using the composition. The composition includes an acid generator that produces an acid upon irradiation with an active ray or radiation; a resin whose solubility in alkali increases under the action of acid; and an organic solvent, in which a predetermined amount of an alkali-soluble resin soluble in an aqueous basic solution having a pH of 12 and containing alkali-soluble groups with hydrogen atoms in at least a part thereof is substituted with an acid-dissociative dissolution-controlling group contained in the resin.

Chemically amplified positive-type photosensitive resin composition

A method is provided that enables the formation of multiple level plated products with large plating depth. A negative photoresist composition comprising (a) an alkali-soluble resin, (b) an acid generator, and (c) other components is used, and a plated product is formed by (A) a step of forming a layer of this negative photoresist composition, and then either heating or not heating, before conducting exposure; (B) a step of repeating the step (A) so that the step is performed a total of 2 or more times, thereby superimposing layers of the negative photoresist, and subsequently developing all of these layers simultaneously to form a multilayer resist pattern; and (C) a step of conducting plating treatment within this multilayer resist pattern.

Method of forming plated product using negative photoresist composition and photosensitive composition used therein

There is provided a positive photoresist composition capable of forming a pattern with excellent resolution, excellent resistance to reflection off the substrate, and excellent perpendicularity. The positive photoresist composition comprises (A) an alkali-soluble novolak resin in which a portion of the hydrogen atoms of all the phenolic hydroxyl groups are substituted with 1,2-naphthoquinonediazidesulfonyl groups, and (B) a dissolution promoter represented by a general formula (b-1) and/or a general formula (b-11) shown below. 

Positive photoresist composition and method of forming resist pattern

A positive photoresist composition comprising an alkali-soluble novolak resin (A) containing a structural unit (a1) represented by a general formula (I) shown below, and a structural unit (a2) represented by a general formula (II) shown below, and a photosensitizer (B) 

Phenolic compound (a) is polycondensed with mixed aldehyde (b) consisting essentially of 5-30 mol % of unsaturated aliphatic aldehyde (b-1) and 70-95 mol % of saturated aliphatic aldehyde (b-2) to give alkali-soluble novolak resin (A) as the product of polycondensation reaction. The alkali-soluble novolak resin (A) is used with quinonediazido group containing compound (B) to produce a positive photoresist composition. According to the present invention, there are specifically provided a positive photoresist composition that has high feature integrity in spite of high sensitivity and which yet provides a great depth of focus, a process for producing such positive photoresist composition, as well as an alkali-soluble novolak resin that can advantageously be used in such composition, and a method of forming patterns with high reproducibility using such positive photoresist composition.

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Kawasaki, Japan

Yasuo Masuda