Kabushiki Kaisha Toshiba

Toshiba Memory Corporation

Yasuo Kudo

Hiroshi Sukegawa

Kazuya Kawamoto

Koichi Nagai

Isao Ozawa

Katsuya Murakami

Isao Maeda

Akira Tanimoto

Hiroyasu Nakatsuka

Mikiya Kurosu

Yuuki Machida

A memory system includes a volatile memory, a nonvolatile memory, and a controller. The controller is configured to execute a non-volatilization process to store data in the volatile memory into the nonvolatile memory in response to an initiate request received by the controller if no cancellation request is received by the controller during a cancelable period that begins upon receipt of the initiate request by the controller, and to transmit a completion notification when the non-volatilization process has completed.

Memory system

According to one embodiment, a semiconductor device includes a board, a sealing portion, a controller, a semiconductor chip, and solder balls. The board includes a first surface and a second surface opposite to the first surface. The controller and the semiconductor chip are covered with the sealing portion. The solder balls are on the second surface of the board. The solder balls include a plurality of solder ball sets each corresponding to a pair of differential input and differential output signals, and the plurality of solder ball sets are arranged substantially parallel to a side of the board.

Semiconductor device and semiconductor package including plural solder ball sets each corresponding to a pair of differential input and differential output signals

According to one embodiment, a memory device is configured to be mounted on a substrate of a host device. The memory device includes a non-volatile memory, a controller circuit, and a wireless communication circuit. The controller circuit is configured to perform data transfer between the host device and the non-volatile memory. The wireless communication circuit is configured to transmit data read from the non-volatile memory with wireless communication, after the controller circuit is set in a state where the data transfer cannot be performed.

Memory device and data transport method

Semiconductor device and semiconductor package

A semiconductor device includes a substrate, a sealing portion, a controller, a semiconductor chip, and a plurality of differential signal balls. The substrate has a first surface and a second surface positioned on a side opposite to the first surface. The sealing portion is formed on the first surface of the substrate. The controller is covered with the sealing portion. The semiconductor chip is electrically connected to the controller, and is covered with the sealing portion. The plurality of differential signal balls are formed on the second surface of the substrate. At least some of the plurality of differential signal balls are arranged substantially parallel to one side of the substrate.

Semiconductor device and semiconductor package having a plurality of differential signal balls

A nonvolatile memory system comprises a nonvolatile memory having a plurality of data areas; and a memory controller operative to control read and write operations to the nonvolatile memory. The memory controller successively executes read/write operations to plural sectors within a selected data area in the nonvolatile memory in accordance with a command and a sector count and sector address fed from a host device.

Growing community of inventors

Higashiyamato, Japan

Yasuo Kudo