Rohm Co., Ltd.

Mitsui Minings & Melting Co., Ltd.

Satosen Co., Ltd.

Yasuo Kanetake

Miki Hasegawa

Yuta Okawauchi

Tomohiro Tomiyasu

Hirotaka Otake

Chojiro Kuriyama

Takukazu Otsuka

Makoto Aoyama

Tatsuya Miyazaki

Tomohiro Murayama

Yuji Kageyama

Naoaki Tsurumi

Katsuyuki Takahashi

A semiconductor device includes a first and a second switching element, a first and a second conductive member, and a capacitor. The first switching element has a first element obverse surface and a first element reverse surface facing away from each other in a first direction. The second switching element has a second element obverse surface and a second element reverse surface facing away from each other in the first direction. The first and second conductive members are spaced apart in a second direction orthogonal to the first direction. The capacitor has a first and a second connection terminal. The first and second switching elements are connected in series, forming a bridge. The first and second connection terminals are electrically connected to opposite ends of the bridge. The capacitor and the first switching element are on the first conductive member, the second switching element on the second conductive member.

Semiconductor device with switching elements connected in series

A multilayer capacitor includes a laminate having a first side surface and a second side surface, a first side covering portion covering the first side surface, and a second side covering portion covering the second side surface. The laminate includes first conductor layers, second conductor layers, dielectric layers and insulating layers laminated in the z direction. Each first conductor layer is connected to the first side covering portion and spaced apart from the second side covering portion. Each second conductor layer is connected to the second side covering portion and spaced apart from the first side covering portion. The insulating layers have a lower dielectric strength than the dielectric layers. Each dielectric layer is sandwiched between a first conductor layer and a second conductor layer. The insulating layers include one sandwiched between two first conductor layers and one sandwiched between two second conductor layers.

Multilayer capacitor

A semiconductor device of an aspect of the disclosure includes a switching element, a substrate, a front electroconductive layer, first through third terminals and a sealing resin. The first through third terminals project toward the same side from the sealing resin along a first direction crossing the substrate thickness direction. The first through third terminals are spaced apart in a second direction crossing the thickness and first directions. The first terminal is at an outermost side in the second direction among the first through third terminals. The sealing resin has root-side and tip-side parts. The root-side part is between the first and third terminals in the second direction and offset in the first direction toward the switching element side of the first and third terminals. The tip-side part is offset in the first direction toward the tip side of the first and third terminals exposed from the sealing resin.

Semiconductor device

A composite material (A) includes a porous sintered body () and an insulation film () which covers the porous sintered body (). The porous sintered body () is made of a combination of a metal element () which has a melting temperature not lower than 1600&#xb0; C., and a nonmetal element (). The insulation film () includes the nonmetal element () and N.

Composite material, capacitor using the same, and their production methods

A solid electrolyte capacitor includes a capacitor element, an anode lead, and a cathode lead. The capacitor element includes a capacitor chip, an anode wire projecting from the capacitor chip, and a cathode electrode formed on outer surfaces of the capacitor chip. The anode lead is electrically connected to the anode wire, whereas the cathode lead is electrically connected to the cathode electrode. A method for making such a solid electrolyte capacitor includes a laser irradiation step for irradiating the anode wire with a laser beam, and a connection step for connecting the anode wire with the anode lead after the laser irradiation step.

Method of making solid electrolytic capacitor having oxidized anode wire

An anode lead ( ) is embedded at one end thereof in a sintered body in a capacitor element ( ), and is welded at the other end thereof to a first outside lead ( ). A cathode ( ) is electrically connected to a second outside lead ( ). The capacitor element is covered with a resin, thereby forming a resin package ( ). The tip end of the first outside lead, to which the other end of the anode lead is welded, is configured in such a manner as to have a capacity greater than those of other portions of the first outside lead: namely, the tip end of the first outside lead is widened or thickened in such a manner as to increase the volume of the first outside lead per unit length. Thus, it is possible to provide a solid electrolytic capacitor having the structure in which inclination of the welded portion of the anode lead can be eliminated or the welding reliability of the anode lead can be enhanced without reducing the size of the sintered body in the capacitor element or increasing the size of the package.

Solid electrolytic capacitor

A method and assembly are provided for mounting a solid electrolytic capacitor onto a printed circuit board including an anode pad and a cathode pad. The capacitor includes a capacitor element which has an anode and a cathode electrically separated by a dielectric substance. The cathode includes an outer cathode terminal layer formed over the element. The method includes the steps of removing a part of the cathode terminal layer to expose a flat anode terminal surface, attaching the element to the printed circuit board for bringing the cathode terminal layer into electrical connection with the cathode pad, electrically connecting the flat anode terminal surface to the anode pad via a metal wire, and enclosing the element in a resin member for protection.

Method of mounting solid electrolytic capacitor onto printed circuit

An encapsulated solid electrolytic capacitor has an anode lead terminal, a cathode lead terminal, a capacitor element and a mold which is made of a synthetic resin material and encapsulates the capacitor element entirely. The capacitor element has an anode bar protruding longitudinally from a main body and is disposed between the anode lead terminal and the cathode lead terminal with the main body being electrically connected to the cathode lead terminal. The tip of the anode bar is welded to the anode lead terminal. The anode lead terminal has integrally formed with it a raised part which is L-shaped as seen longitudinally and is capable of having the anode bar inserted under its middle part, preventing it from becoming bent when it is soldered.

Encapsulated solid electrolytic capacitors and method of producing same

Provided is a solid electrolytic capacitor including a capacitor element, an internal anode lead extending from a substantially central portion of one lateral surface of the capacitor element, other surfaces of the capacitor element normal to the lateral surface being adapted to serve as cathode terminal walls, an external anode lead connected to the internal anode lead, an external cathode lead connected to one of the cathode terminal wall, and a resin mold encapsulating the capacitor element as well as connecting portions associated therewith, wherein the external anode lead connected to the internal anode lead is bent to have at least two steps at its end portion, a lower step of said at least two steps being fixed to another one of the cathode terminal walls through an insulating material, an upper step of said at least two steps being fixed to the internal anode lead. The solid electrolytic capacitor prevents the capacitor element thereof from being displaced and the leads thereof from breaking, allows an easy assembling operation, and contributes to the down-scaling of a capacitor.

An electronic component is provided which comprises a resin package for enclosing inside parts, and at least one lead terminal projecting out from the resin package to have a bonding end. The lead terminal is bent to provide an armpit-like portion between the lead terminal and the resin package for retaining a solder wire in a sandwiched state. At the time of mounting the electronic component to a circuit board, the solder wire be caused to melt at a soldering temperature for merging with solder fillets along the bonding end of the lead terminal.

Resin-packaged electronic component having bent lead terminals

A surface mounting type polar electronic component is provided which comprises a polar element electrically connected to a positive lead and a negative lead, and a package enclosing the polar element together with part of the respective leads, the package having a mounting face. The leads have respective contact ends bent substantially in parallel to the mounting face of the package for contact with corresponding electrode pads of a circuit board. One of the leads has a projection extending beyond the contact end of said one lead for insertion into an insertion hole formed at a relevant one of the electrode pads.

Surface mounting type polar electronic component

A solid electrolytic capacitor of the type having a built-in fuse is disclosed in which a connecting portion between the fuse and a capacitor element is made thin and securely formed to accommodate the capacitor element to be increased in capacitance without changing the outer size of a resin package. The solid electrolytic capacitor including a capacitor element, an internal anode lead extending from one surface of the capacitor element, other surfaces of the capacitor element serving as a cathode terminal wall, an external anode lead connected to the internal anode lead, an external cathode lead connected to the cathode terminal wall through a fuse, and a resin package encapsulating the capacitor element, the fuse and respective connecting portions of the external anode lead and the external cathode lead. A connecting portion between the fuse and one end of the external cathode lead lies adjacent the capacitor element and in or out of a plane coplanar with the surface of the cathode terminal wall to which the fuse is pressure-welded.

A package-type solid electrolytic capacitor is provided which comprises a pair of capacitor elements, a pair of diodes associated with the capacitor elements, a pair of leads associated with the capacitor elements and the diodes, and a resin package enclosing the capacitor elements, the diodes and part of the leads. The leads may be exchangeably connectable to a positive and a negative electrodes of a circuit pattern. In one state of lead connection, one of the diodes passes a current only for one of the capacitor elements. In the other state of lead connection, the other diode passes a current only for the other capacitor element. Thus, the capacitor is non-polar and therefore can be mounted without paying any attention to the polarity.

Package-type solid electrolytic capacitor

A solid electrolytic capacitor is constructed by a capacitor element body, a metal rod extended through the central part of the element body, an anode member, and an insulating layer placed between the flange part of the anode member and the element body. The capacitor element body consists of a chip-like porous solid formed by shaping and sintering rectifying metal particles, the porous solid having a dielectric layer and a solid electrolytic layer both being formed thereon. The anode member includes a protruded part and a flange part, the end face of the protruded part being brought into contact and connected with one of the end faces of the metal rod. A method of manufacturing solid electrolytic capacitors thus constructed is also disclosed.

Solid electrolytic capacitor and manufacturing method thereof

A solid electrolytic capacitor is provided which comprises a capacitor element including a chip and an anode wire projecting from the chip, an anode lead electrically connected to the anode wire, a cathode lead electrically connected to the chip, and a resin package enclosing the capacitor element together with part of the anode and cathode leads. The resin package has a first end face from which the cathode lead projects out, and a second end face located adjacent to the anode lead. Each of the anode and cathode leads is bent outside the package toward the underside thereof. The resin package includes a larger width portion adjacent to the first end face and a smaller width portion adjacent to the second end face. The anode lead extends transversely of the anode wire and projects laterally from the smaller width portion.

Growing community of inventors

Kyoto, Japan

Yasuo Kanetake