Kabushiki Kaisha Toshiba

Yasuo Iizuka

Hirokazu Ichikawa

Akira Komatsu

A solid state image sensor device has a semiconductor substrate, picture elements arranged on the semiconductor substrate in a matrix, and microlenses. Each microlens is arranged with a plurality of single-layer microlens parts on each picture element for condensing an incident light transferred from outside of the solid state image sensor device.

Solid state image sensor device with microlenses

There is provided a solid state image pickup device, comprising: a semiconductor substrate; a plurality of photosensitive elements formed on the surface of the semiconductor substrate; light shielding elements positioned above the substrate for covering the regions other than the photosensitive elements; a plurality of light converging elements each for converging an incident light to each of the photosensitive elements, the light converging elements being formed above the photosensitive elements at the level above the light shielding elements at a predetermined pitch; and reflecting elements formed between non-lens regions between the light converging elements and the light shielding elements, the reflecting elements each having a reflection surface for reflecting a light incident to the converging means and the non-lens regions or at least a light incident to the non-lens region toward the photosensitive element.

Solid state image pickup device with mirrors

There is provided an improvement on a solid-state type color image sensor having a color filter arrangement matching the line sequential color difference signal method. A color filter selected from magenta, yellow and cyan for covering the entire area of each picture cell and a color filter of a different color are superposed one upon the other. The color filters covering predetermined ratios of the areas of associated picture cells are preferably formed collectively in a stripe shape.

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Yokohama, Japan

Yasuo Iizuka