Kabushiki Kaisha Toshiba

Yasuo Idei

Hideto Sugawara

Koichi Nitta

Kuniaki Konno

Hirohisa Abe

Toshio Shimizu

Hideki Nozaki

Ryo Saeki

Katsufumi Kondo

Kazumi Unno

Katsuhiko Nishitani

A light emitting device includes: a multilayer body including a light emitting layer made of a semiconductor; a first bonding metal layer attached to the multilayer body; a substrate; and a second bonding metal layer attached to the substrate and bonded to the first bonding metal layer at a bonding interface, at least one of a planar size of the first bonding metal layer on the bonding interface side and a planar size of the second bonding metal layer on the bonding interface side being smaller than a planar size of the substrate.

Light emitting device and method for manufacturing same

A semiconductor light emitting device includes: an upper growth layer including a light emitting layer; a transparent substrate through which a radiant light from the light emitting layer passes; and a foundation layer provided between the upper growth layer and the transparent substrate, the foundation layer having a surface-controlling layer and a bonding layer bonded with the transparent substrate. The surface-controlling layer is made of compound semiconductor including at least Ga and As. The upper growth layer is formed on an upper surface of the surface-controlling layer. A lattice constant difference at an interface between the surface-controlling layer and the upper growth layer is smaller than that at an interface between the bonding layer and the transparent substrate.

Semiconductor light emitting device and method for manufacturing same, and epitaxial wafer

There are provided a semiconductor light emitting device wherein the variation in tone in each device is small and the variation in tone due to deterioration with age is also small, and a method for manufacturing the same. The semiconductor light emitting device includes an active layer for emitting primary light having a first wavelength by current injection, and a light emitting layer excited by the primary light for emitting secondary light having a second wavelength different from said first wavelength, wherein the primary light and the secondary light are mixed to be outputted.

Semiconductor light emitting device and method for manufacturing same

Semiconductor light emitting device having a fluorescent material emitting light of a secondary wavelength

A semiconductor light emitting device has a semiconductor substrate (1). On a first principal plane of the substrate, an emission layer is formed. In a predetermined region on the emission layer, a current blocking layer (10) is formed. On the current blocking layer, an excitation electrode (20) is formed. A substrate electrode (9) is formed on a second principal plane of the substrate. The excitation electrode is composed of a bonding pad (21) and a current supply electrode (22). The current blocking layer is under the bonding pad. The current blocking layer prevents a current from flowing under the bonding pad. The current supply electrode improves the light emission efficiency of the device.

Semiconductor light emitting device with blocking layer

A semiconductor light emitting element in which light leakage from the vicinity of an active layer end thereof is significantly reduced, and an interval at which the element is disposed is sufficiently narrow, so that there can be realized an optimal distance-measuring accuracy when used for a light source of a camera's automatic focusing mechanism. The semiconductor light emitting element includes a double heterojunction structure such that a GaAlAs current restriction layer formed with a conductive region is formed on a GaAs semiconductor substrate and a light emitting region of the light emitting element diode is provided therein by forming a p-n junction surfaces, the semiconductor light emitting element being characterized in that a plurality of the light emitting diodes are electrically isolated from each other by a plurality of grooves formed substantially vertical to the p-n junction and an end face of the light emitting region cut through by the groove is disposed inside a vertical line drawn from an end face of the surface of the light emitting element.

Semiconductor light emitting element with improved structure of groove

To form a semiconductor light emitting element provided with three light emitting portions into a monolithic structure, the element of double heterojunction structure has a p-type GaAs semiconductor substrate, an n-type GaAlAs current restriction layer formed with conductive regions arranged at regular intervals, a p-type GaAlAs cladding layer, a p-type GaAlAs active layer, an n-type GaAlAs cladding layer, and two grooves formed extending from the surface of the n-type GaAlAs cladding layer deep through the p-type GaAlAs active layer and between the two adjacent conductive regions. Since the three light emitting portions are formed at precise intervals in a monolithic structure, when mounted on a camera for use with an automatic focusing mechanism, it is possible to measure a distance to a subject in trigonometrical survey without the subject being out of focus.

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Tama, Japan

Yasuo Idei