Mitsubishi Denki Kabushiki Kaisha

Yasuo Furuhashi

Akira Yamada

Fumiaki Baba

Shoji Yamaguchi

Hirofumi Fujioka

Toshiyuki Toyoshima

Satoshi Yanaura

Method of producing a multi-layered wiring board comprising the steps of subjecting the photosensitive resin to exposure- and development-treatment to form the holes having a predetermined size and shape; depositing and forming the curable resin to the insulating layer having the holes formed therein in such a manner as to bury the holes, and conducting heat-treatment to form the cured thin film of the curable resin on the surface of the insulating layer; and so removing the curable resin as to leave the cured thin film to obtain the via-holes having the reduced opening size by the cured thin film.

Method of producing a multi-layered wiring board

An apparatus for producing a multi-layer printed circuit board. The printed circuit board includes a bottom layer board, a hole board, and an adhesive sheet between the bottom layer board and the hole board. The printed circuit board is heated so that adhesive sheet bonds the bottom layer board to the hole board. A mold release sheet and a thermoplastic resin sheet begins to soften at a temperature lower than the melting temperature of the adhesive. A contraction control member controls contraction when the thermoplastic resin sheet cools.

Method for manufacturing multi-layer printed board

A method for producing multi-layer printed board. The method includes heating a hole board as a top layer, an adhesive sheet, and a bottom layer board. The adhesive sheet includes a mold release sheet and a thermoplastic resin sheet which begins to soften at a temperature lower than the melting temperature of the adhesive. A contraction control member controls contraction when the thermoplastic resin sheet cools.

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Tokyo, Japan

Yasuo Furuhashi