Panasonic Intellectual Property Management Co., Ltd.

Panasonic Corporation

Matsushita Electric Works, Ltd.

Yasuo Fukuhara

Atsushi Yamaguchi

Hiroaki Fujiwara

Yuki Kitai

Yoshihiko Nakamura

Masahiro Matsumura

Jin Jin

Yukio Hatta

Masaharu Yamamoto

Akihiro Atsumi

Hiroshi Toshima

Takayuki Fukuda

Tomoaki Watanabe

Kiyohiro Nagao

Makizi Miyao

Mao Yamaguchi

Shigekazu Takanohashi

An electronic-part-reinforcing thermosetting resin composition has: a viscosity of 5 Pa&#xb7;s or less at 140&#xb0; C.; a temperature of 150&#xb0; C. to 170&#xb0; C. as a temperature corresponding to a maximum peak of an exothermic curve representing a curing reaction; and a difference of 20&#xb0; C. or less between the temperature corresponding to the maximum peak and a temperature corresponding to one half of the height of the maximum peak in a temperature rising range of the exothermic curve.

Electronic-part-reinforcing thermosetting resin composition, semiconductor device, and method for fabricating the semiconductor device

Provided is a paste thermosetting resin composition containing solder powder, a thermosetting resin binder, an activator, and a thixotropy imparting agent. The solder powder has a melting point ranging from 100&#xb0; C. to 240&#xb0; C., inclusive. The thermosetting resin binder contains a main agent and a curing agent. The main agent contains a di- or higher functional oxetane compound.

Paste thermosetting resin composition, semiconductor component, semiconductor mounted article, method for manufacturing semiconductor component, and method for manufacturing semiconductor mounted article

A semiconductor component includes a semiconductor package having a mountable face, a bump, and a coating part. The bump is made of first solder and is formed on the mountable face. The coating part formed of a first composition containing solder powder made of second solder, a flux component, and a first thermosetting resin binder coats the top end of the bump.

Semiconductor component, semiconductor-mounted product including the component, and method of producing the product

A semiconductor-mounted product includes a semiconductor package, a circuit board, a solder bonding part, and a resin reinforcing part. Wiring is formed on the surface of the circuit board, and the semiconductor package is mounted on the circuit board. The solder bonding part electrically connects the semiconductor package with the wiring. The resin reinforcing part is formed on a side surface of the solder bonding part such that the solder bonding part is partially exposed. The bonding part has a first solder region formed closer to the semiconductor package than the circuit board, and a second solder region formed closer to the circuit board than the semiconductor package.

Semiconductor-mounted product and method of producing the same

The invention relates to a prepreg, obtained by impregnating a base material with an epoxy resin composition containing an epoxy resin (A), a curing agent (B), an accelerator (C), a phenoxy resin (D), and an inorganic filler (E) and semi-hardening the impregnated material, wherein the inorganic filler (E) has an average particle diameter of 3 &#x3bc;m or less. When a circuit with a narrow wire distance is formed on a surface of a insulator substrate composed of such a prepreg by using a method of forming the circuit by plating process, an amount of the plating remaining on the insulator substrate surface at the circuit contour periphery can be reduced. As a result, it leads to stabilization of inter-circuit insulation resistance and increase in a yield during production of printed wiring boards.

Prepreg, printed wiring board, multilayer circuit board, and process for manufacturing printed wiring board

In a process for manufacturing a prepreg for use as an electrically insulating material, a main epoxy resin composition and a subsidiary resin composition containing a hardener which have been separately filtered and metered are quickly mixed into a mixture resin composition, a reinforcing member is coated with a uniformly thin film of the mixture resin composition by a die coater under specific temperature, average residence time and low shear conditions, the coated reinforcing member is heated in non-contact manner by an infrared ray heater to have the member impregnated with the resin composition of the film, the member is further heated in non-contact manner by a floating dryer to have the resin composition semi-hardened, and the member is unified through compaction rolls, whereby the prepreg in the form of a sheet-shaped fiber reinforced composite material is continuously manufactured.

Process for manufacturing prepregs for use as electric insulating

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Osaka, Japan

Yasuo Fukuhara