Ngk Spark Plug Company, Limited

Yasuo Doi

Kazuhisa Sato

Hisashi Wakako

Masahiro Iba

Hiroyuki Hashimoto

Sumio Ohta

The wiring board is provided with the first resin insulating layer , the first filled via penetrating it and filled and formed by the plating, and the second conductor layer formed by the plating on them. In them, the second conductor layer comprises the first resin insulating layer , the electroless plating layer formed on the first filled via , and the electrolytic plating layer composed of plating particle of substantially uniform size, formed thereon.

Wiring board and method of producing wiring board

A process for producing a substrate having a base-metal plating layer, which includes an immersion step for immersing the substrate in a plating solution contained in a plating tank , to thereby form a base-metal plating layer; a washing step for removing the substrate from the plating tank , transferring the substrate to a washing tank, and washing the substrate ; and a cooling step for applying a cooling liquid to the substrate during at least a portion of the period during which the substrate is transferred to a position where the washing step is carried out after completing the immersion step, to thereby cool the substrate . An apparatus for carrying out the above process is also disclosed.

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Nakata-gun, Japan

Yasuo Doi