Dai Nippon Printing Co., Ltd.

Yasunori Tanaka

Masachika Masuda

Hiromichi Suzuki

Koji Tomita

Hiroshi Ohsawa

Kazuyuki Miyano

Atsushi Kurahashi

Tadashi Okamoto

A semiconductor device includes, a lead frame having a die pad and a plurality of leads each disposed around the die pad, a semiconductor element rested on the die pad of the lead frame, and bonding wires for electrically interconnecting the lead of the lead frame and the semiconductor element. The lead frame, the semiconductor element, and the bonding wires are sealed with a sealing resin section. The sealing resin section includes a central region provided over and around the semiconductor device, and a marginal region provided in the periphery of the central region. Thickness of the central region is greater than that of the marginal region.

Semiconductor device and manufacturing method therefor

Growing community of inventors

Asaka, Japan

Yasunori Tanaka