Kabushiki Kaisha Toshiba

Nec Corporation

Dupont Teijin Advanced Papers (japan) Limited

E.i. Dupont De Nemours and Company

Nitto Shinko Corporation

Tosbac Computer System Company Limited

Waseda University

Dupont Teijin Advanced Papers, Ltd.

Yasunori Tanaka

Shinji Naruse

Tatsushi Fujimori

Chihiro Kondo

Toshikazu Sei

Shinji Ochi

Koji Yamashita

Michinobu Tanioka

Yukinori Uchino

Hirotsugu Shirakawa

David Wayne Anderson

Yoshiki Takahashi

Yasuyuki Kihara

Eiji Hagimoto

Masanori Imai

Kazuyuki Kawashima

Teruo Kobayashi

Kyohsuke Ogawa

Koichi Ukigaya

Hidenori Takayama

Ikue Yamamoto

Hideo Hashimoto

Masahiro Ishibashi

Toshiyuki Nishihara

Hiroaki Suzuki

Hiroyuki Hara

Kei Tanaka

Hiroshi Shigehara

Takuo Funaya

Kohei Tatsumi

Masahiro Fujii

Naoki Takahashi

Toshiaki Mori

Eiichi Fukiharu

Tsunenobu Kouda

Tomohiro Fujisaki

Koichi Notoya

Kyosuke Ogawa

Kenichi Otake

Kaoruko Yamada

Izumi Sakai

Junya Masumi

A semiconductor element bonding structure capable of strongly bonding a semiconductor element and an object to be bonded and relaxing thermal stress caused by a difference in thermal expansion, by interposing metal particles and Ni between the semiconductor element and the object to be bonded, the metal particles having a lower hardness than Ni and having a micro-sized particle diameter. A plurality of metal particles(aluminum (Al), for example) having a lower hardness than nickel (Ni) and having a micro-sized particle diameter are interposed between a semiconductor chipand a substrateto be bonded to the semiconductor chip, and the metal particlesare fixedly bonded by the nickel (Ni). Optionally, aluminum (Al) or an aluminum alloy (Al alloy) is used as the metal particles, and aluminum (Al) or an aluminum alloy (Al alloy) is used on the surface of the semiconductor chipand/or the surface of the substrate

Semiconductor element bonding structure, method for producing semiconductor element bonding structure, and electrically conductive bonding agent

Provided is a method for producing a laminate, comprising laminating an aramid paper sheet and a polyimide film together by performing heating and pressurizing process under conditions of a temperature of 275 to 320&#xb0; C. and a pressure of 50 to 400 kgf/cm. In the present invention, an aramid paper sheet-polyimide film laminate with excellent heat resistance, electrical properties, chemical resistance, mechanical properties, and the like can be manufactured by laminating the aramid paper sheet and the polyimide film in a simple method without impairing their properties.

Laminate of aramid paper sheet and polyimide film and method for producing same

The present invention provides an electromagnetic wave suppression sheet provided with: an absorption layer which has surface resistivity of at least 100&#x3a9;/&#x25a1; and which contains an electrical conductive material and an insulating material in the state where the electrical conductive material and the insulating material are in direct contact with each other, the insulating material having a dielectric loss tangent of 0.01 or larger at a frequency of 60 Hz at 20&#xb0; C.; and a contact layer which is formed on a surface, of the absorption layer, opposite to a surface to be irradiated with electromagnetic waves and of which a surface in contact with the absorption layer has surface resistivity of at least 20&#x3a9;/&#x25a1;.

Electromagnetic wave suppression sheet

A motor bobbin having a bobbin body portion around which a coil is to be wound, and flange portions provided integrally to both end portions of the bobbin body portion. The bobbin includes: a molded resin article formed by using a polymer having amide linkages, and an insulating paper having an aramid paper made of an aramid fibrid and an aramid short fiber. The surface of the molded resin article and the aramid paper are directly bonded to each other. The motor bobbin can cope with an increased efficiency and an increased power output of a motor generator or the like.

Motor bobbin

A charge pump circuit includes a capacitor, a first switch between the capacitor and a power supply terminal, a second switch between the capacitor and an output terminal, a third switch between the output terminal and the capacitor, a fourth switch between the capacitor and a ground terminal, and a control unit configured to generate control signals for the switches. The control signals include first signals generated during a first period that cause first and third switches to be in an ON state and second and fourth switches to be in an OFF state, second signals generated during a second period that cause first and third switches to be in an OFF state and second and fourth switches to be in an ON state, and third signals generated between the first and second periods, that cause the ON/OFF state of each of the switches to be switched at different times.

Charge pump circuit and step-down regulator circuit

Provided is a motor bobbin around which a winding wire is wound, said motor bobbin comprising insulating paper and a resin molded body. The insulating paper and the resin molded body are coupled and fixed together without using an adhesive agent. Surfaces of the insulating paper which are in contact with the resin molded body are configured using aramid paper comprising an aramid fibrid and aramid short fibers. Resin is melt extruded and thermal-fusion bonded upon the aramid paper comprising the aramid fibrid and the aramid short fibers, and the surfaces configured from the aramid paper are surface treated to obtain the insulating paper. The motor bobbin is obtained by bringing melted portions of the resin molded body into contact with the top of the aramid paper.

In a method for manufacturing a motor bobbin around which a coil is wound, an insulating sheet and a core material are disposed within the cavity of an injection mold, and the motor bobbin is formed by the injection mold into which a resin is injected. The motor bobbin consists of the insulating sheet and a resin molded body.

Motor bobbin and method for manufacturing same

A polyamide resin composition which can improve heat resistance and water absorbency while suppressing the deterioration of processability is provided. Provided is a polyamide resin composition having an aromatic polyamide resin and an epoxy group-containing phenoxy resin having an epoxy group in the molecule of the phenoxy resin, wherein the content of the epoxy group-containing phenoxy resin is 30 to 50% by mass.

Aromatic polyamide and epoxy group-containing phenoxy resin

A laminate sheet that can be easily produced together with improving the heat resistance and the water absorbency. Provided is a laminate sheet prepared by laminating plural sheet materials by a resin composition, wherein the resin composition is comprised of an aromatic polyamide resin and an epoxy group-containing phenoxy resin having an epoxy group in the molecule, and the resin composition is a polyamide resin composition that contains 30 to 50% by mass of the epoxy group-containing phenoxy resin.

Laminate sheet

A soldering method achieving a high-strength joint between a solder and an nickel/gold electroless plated surface is disclosed. The nickel/gold electroless plated layer is soldered using a solder including tin (Sn), silver (Ag), and copper (Cu). At a solder joint, a layer sturcture of nickel layer/intermetallic compound layer/solder layer is formed. The intermetallic compound layer is composed mainly of tin (Sn) and copper (Cu), and further including nickel (Ni). The intermetallic compound layer has cauliflower-shaped surfaces formed in a solder-layer's side thereof.

High-strength solder joint

There is provided a printed wiring board having upper and lower surfaces, including a resin layer formed in a predetermined region on the upper and/or lower surfaces, the resin layer integrally adhered to the printed wiring board and having a thickness sufficient to reinforce rigidity of the printed wiring board. For instance, when the printed wiring board includes an electric part having an exposed contact surface, on the upper and/or lower surfaces, the resin layer is not formed on the upper and/or lower surfaces. In accordance with the present invention, it is possible to reinforce a printed wiring board without an increase in weight.

Printing wiring board

A structure for mounting a SAW (Surface Acoustic Wave) device includes photosensitive resin filling a gap between the SAW device and a mounting substrate in the peripheral portion of the SAW device. The entire structure is substantially as small in size as the SAW device and light weight. The photosensitive resin is formed in a region including pads for connection in order to absorb thermal stresses and extraneous forces apt to act on the pads. Second resin may surround the photosensitive resin or may be provided in a laminate structure together with the photosensitive resin so as to enhance a sealing ability. A method of mounting a SAW device is also disclosed.

Structure and method for mounting a saw device

A semiconductor device comprises a substrate on which a plurality of external connection terminals are formed, and a semiconductor chip provided with a plurality of connection terminals. The connection terminals are connected to corresponding external connection terminals by electrical wiring. Each of predetermined connection terminals in the connection terminals of the semiconductor chip is connected to two or more corresponding external connection terminals on the substrate. Preferably, 90% or more of the connection terminals of the semiconductor chip are connected to two or more corresponding external connection terminals. When the semiconductor device is installed on a circuit board, the semiconductor device is mounted on the circuit board with its external connection terminals facing the circuit board, and electric connections between the semiconductor device and the circuit board is established by the external connection terminals. According to the semiconductor device, connection reliability between the semiconductor device and the circuit board can be remarkably improved and installation process can be executed with a higher success rate and a remarkably higher degree of efficiency.

Semiconductor device with improved connection reliability

A chip package device comprises on its outside surface a plurality of wire bonding electrodes adjacent a plurality of facedown electrodes. The chip package device comprises an IC chip having a plurality of chip electrodes on its face surface and a contact sheet having an inside surface on the face surface and comprising on the outside surface a plurality of conductor patterns which comprises portions extending through the contact sheet to the chip electrodes, respectively, and defines the facedown and the wire bonding electrodes. Such chip package devices can be mounted on a printed circuit board in whichever of a facedown and a wire bonding manner when primary and secondary pads are formed on the board for mechanical and electrical connection to the facedown electrodes, respectively, and for electric connection by bonding wires to the wire bonding electrodes, respectively.

Chip package device mountable on a mother board in whichever of facedown

Growing community of inventors

Tokyo, Japan

Yasunori Tanaka