Komatsu Corporation

Yasunori Sato

Katsushi Fukuda

Takeshi Kajihara

Hiroshi Yamamoto

Tatsuo Aira

Akio Konishi

Ryuusuke Komura

Akinobu Iwasaki

Kenichi Tomita

Kiyoharu Sasaki

Keisuke Ikeda

A spherical slide bearing has an outer ring and an inner ring slidably retained within the outer ring. A pin having a grease supply flow path extending through an interior thereof to open in an outer peripheral surface thereof is inserted into the inner ring so that the pin is circumferentially slidable, with the inner ring being equipped with a communication flow path establishing communication between a gap defined between the inner ring and the pin and a gap defined between the inner ring and the outer ring. The inlet port of the communication flow path is provided at a position where grease having flown out of an outlet port of the grease supply flow path flows after having flown through the gap between the pin and the inner ring substantially through the entire length in the axial direction of the pin.

Spherical slide bearing system

Powder of a semiconductor material and solvent are packed into a rubber tube and both ends of the rubber tube are fixed by fixing rings in a condition with sealing in the vertical direction effected by an upper cover and a lower cover. After this, the rubber tube is immersed in an oil bath and pressure is applied uniformly from the side faces to the semiconductor material within the rubber tube, using hydraulic pressure. An extrusion molding of rectangular shape and of smaller cross sectional area than before molding is formed by extrusion from an extrusion port of rectangular solid shape of a die (extrusion mold) in which pressure is applied in an extrusion direction D by a punch to a rectangular solid sintered body of thermoelectric semiconductor material.

Thermoelectric semiconductor material, thermoelectric element, method of manufacturing these and method of manufacturing thermoelectric module and device for manufacturing thermoelectric semiconductor material

A thermoelectric semiconductor material having sufficient strength and performance and high production yield. The thermoelectric semiconductor material is characterized in that a sintered powder material of a thermoelectric semiconductor having a rhombohedral structure (or hexagonal structure) is hot-forged and plastically deformed to direct either the crystals of the sintered powder structure or the subcrystals constructing the crystals in a crystal orientation having an excellent figure of merit.

Thermoelectric semiconductor material, manufacture process therefor, and method of hot forging thermoelectric module using the same

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Hiratsuka, Japan

Yasunori Sato