Denso Corporation

Harima Chemicals, Incorporated

Yasunori Ninomiya

Masashi Totokawa

Ryuichiro Abe

Hirokazu Imai

Yukinori Migitaka

Naoto Shioi

Nobuto Terada

A virtual image display device includes a display that emits display light, a reflective mirror that has a reflective surface, and a housing that houses the display and the reflective mirror and has an opening. The housing includes a wall structure on a portion of a surface of the housing. The wall structure includes a plurality of first walls that face in a first common direction and a plurality of second walls that face in a second common direction different from the first common direction. The plurality of first walls and the plurality of second walls are alternately arranged and are connected to each other one by one along the surface of the housing.

Virtual image display device

A sensor device includes a board, a sensor element and a resin member made of resin. The sensor element has a displace part to be displaced in a predetermined detection direction, and detects a displace amount of the displace part in the detection direction. The sensor element is mounted and connected to the board through the resin member. The resin member is arranged between the sensor element and the board in part such that a warp of the sensor element in the detection direction due to a temperature variation is smaller than a warp of the sensor element in a direction except for the detection direction.

Sensor device

The present invention provides a conductive adhesive that is applicable as means for forming conductive junction to process for surface mounting of electronic parts for vehicle loading and process for the manufacture of the electronic parts per se for the purpose of substituting soldering therewith. The conductive adhesive according to the present invention is a conductive adhesive produced by dispersing a conductive medium, such as silver powder, in a binder resin component of a one-component epoxy thermosetting resin which has such a composition that the resin comprises, as essential components, an epoxy resin component composed mainly of an epoxy compound with a polycyclic aromatic ring skeleton, and a cyclic acid anhydride as a curing agent component thereof, and is further added with a coupling agent as an adherence imparting agent therefor.

Conductive adhesive

A method of producing a circuit board includes a step of providing a conductive paste including metal nano-particles at an insulating substrate, and a step of sintering the conductive paste so as to form a circuit conductor. In the sintering step, the conductive paste is sintered in a low-oxygen condition including alcohol such that the metal nano-particles are sintered.

Method of producing circuit board

A conductive adhesive is formed by mixing a plurality of conductive fillers into a thermosetting resin. The conductive filler includes a core material made of copper-based metal, a coating film made of silver and a plurality of particles made of silver. The coating film is provided on the core material to cover the core material, and the particles are provided on a surface of the coating film. Accordingly, a surface of the core material is prevented from being exposed. The conductive adhesive can be suitably used for bonding two members.

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Kariya, Japan

Yasunori Ninomiya