Murata Manufacturing Co., Ltd.

Yasunori Kishimoto

Norio Taniguchi

Takashi Iwamoto

Mitsuyoshi Hira

A piezoelectric device ensures resistance to molding without an increase in costs and includes an elemental substrate having a piezoelectric element and a conductive pattern electrically connected to the piezoelectric element; and insulating members disposed on the elemental substrate and surrounding the piezoelectric element leaving a space around the piezoelectric element. The insulating members have an internal conductor connected to the conductive pattern and extending apart from the elemental substrate. The internal conductor has expanded portions expanding in a direction intersecting the wiring direction of the internal conductor or a detour portion deviating from the wiring direction. The expanded portions or the detour portion crosses the boundary of a sealed space formed around the piezoelectric element.

Piezoelectric device and method for producing same

A surface acoustic wave branching filter reduces deterioration of the insertion loss and improves the isolation characteristics. The surface acoustic wave filter includes first ends of a first acoustic wave filter, having a relatively low passband, and a second acoustic wave filter, having a relatively high passband, connected to a first common terminal which is connected to an antenna. A resonator of the first surface acoustic wave filter, among a plurality of parallel-arm resonators and a plurality of series-arm resonators, which is closest to the first common terminal is a parallel-arm resonator. The capacitance of the parallel-arm resonator that is closest to the first common terminal is less than &#xbd; of the capacitance of the other parallel-arm resonators.

Surface acoustic wave duplexer

A surface acoustic wave duplexer includes a transmission-side surface acoustic wave filter and a receiving-side surface acoustic wave filter which are connected to an antenna terminal, and the transmission-side surface acoustic wave filter and the receiving-side surface acoustic wave filter are mounted on a package material. The surface acoustic wave duplexer further includes a high-frequency wave element which is connected to the transmission-side surface acoustic wave filter and the receiving-side surface acoustic wave filter, and at the same time, has two trap attenuation poles at the higher frequency side than at least the transmission-side pass band and the receiving-side pass band.

Surface acoustic wave branching filter

A composite electronic component that prevents the electrical connection between a conductive case member of the composite electronic component, which performs physical shielding against a physical impact or dust adhesion and also performs an electromagnetic shielding function, and a conductive member for performing the electromagnetic shielding function for a surface acoustic wave element built therein. A composite electronic component includes surface acoustic wave devices therein, a first case member, and a second metallic case member. In order to prevent the electrical connection between the internal surface of the metallic case connected to a ground potential and a conductor disposed in a package of the surface acoustic wave devices and connected to the ground potential to perform the electromagnetic shielding function, an insulating material layer is provided on at least one of the top surface of the conductor and the bottom surface of a top plate of the metallic case.

Composite electronic component

A surface acoustic wave branching filter includes a first surface acoustic wave filter chip having a relatively low center frequency and a second surface acoustic wave filter chip having a relatively high center frequency which are joined to a chip mounting surface of a packaging member. A bump of the second surface acoustic wave filter chip is joined to a signal wiring pattern disposed on the chip mounting surface of the packaging member. The signal wiring pattern is configured to have a pattern portion that is in closer proximity to a ground wiring pattern than to the bump.

Growing community of inventors

Yasu, Japan

Yasunori Kishimoto