Hamamatsu-Photonics K.k.

Olympus Corporation

Japan Science and Technology Agency

Tokai National Higher Education and Research System

National University Corporation Tokai National Higher Education and Research System

Nippon Roper Kk

Yasunori Igasaki

Norihiro Fukuchi

Junji Okuma

Haruyoshi Toyoda

Tsutomu Hara

Takashi Inoue

Narihiro Yoshida

Yotaro Wani

Takeshi Sakamoto

Naoya Matsumoto

Hiroshi Amano

Daisuke Kawaguchi

Chiaki Sasaoka

Teruo Hiruma

Aiko Nakagawa

Atsushi Tanaka

Mitsuhiro Nagao

Mamiko Matsunaga

Hideki Shimoi

Yuu Takiguchi

Yutaka Hasegawa

Tadaaki Hirai

Yoshinori Iketaki

Toshio Suzuki

Masaaki Fujii

Haruyasu Ito

Takafumi Ogiwara

Takeshi Watanabe

Tsubasa Hirose

Toshiki Yui

Takeshi Yamada

Yasunaga Nara

Osamu Nakane

Koichi Ogusu

Yoshinori Okamura

A laser processing apparatus includes a support part, a light source, a spatial light modulator, a converging part, and a controller. The controller controls the spatial light modulator so that laser light is branched into a plurality of rays of processing light including 0th-order light and a plurality of converging points for the plurality of rays of processing light are located at positions different from each other in a Z direction and an X direction, and controls at least one of the support part and the converging part so that the X direction coincides with an extension direction of a line and the plurality of converging points move relatively along the line. The controller controls the spatial light modulator so that a converging point of the 0th-order light is located one side with respect to a converging point of non-modulated light of the laser light, in the X direction.

Laser processing device, and laser processing method

There is provided a laser processing method for cutting a semiconductor object along a virtual plane facing a surface of the semiconductor object in the semiconductor object. The laser processing method includes a first step of forming a plurality of first modified spots along the virtual plane to obtain first formation density, by causing laser light to enter into the semiconductor object from the surface, and a second step of forming a plurality of second modified spots along the virtual plane so as to obtain second formation density higher than the first formation density, by causing laser light to enter into the semiconductor object from the surface after the first step.

Laser processing method, semiconductor member manufacturing method, and laser processing device

A laser processing device configured to emit laser light on an object to perform laser processing of the object, the laser processing device including: a laser output unit configured to output the laser light; a spatial light modulator configured to reflect the laser light output from the laser output unit while modulating the laser light in accordance with a phase pattern; and an objective lens configured to converge the laser light from the spatial light modulator toward the object, in which the spatial light modulator includes an entrance surface, a reflective surface, and a modulation layer configured to display the phase pattern to modulate the laser light, and a dielectric multilayer film having a high reflectance region in a plurality of wavelength bands non-contiguous with each other is formed on the reflective surface.

Laser processing device

There is provided a laser processing device that performs laser processing on an object made of a birefringent material, the device including: a light source that outputs laser light; a spatial light modulator that modulates the laser light output from the light source; a focusing lens that focuses the laser light toward the object; and a polarized light component control unit that is a function of the spatial light modulator to control polarized light components of the laser light such that the laser light is focused on one point in the object in a Z direction (optical axis direction).

A laser processing device includes: a device frame; a support unit attached to the device frame and configured to support an object to be processed; a laser output unit attached to the device frame; and a laser converging unit attached to the device frame so as to be movable with respect to the laser output unit. The laser output unit includes a laser light source configured to emit laser light, and the laser converging unit includes: a reflective spatial light modulator configured to reflect the laser light while modulating the laser light; a converging optical system configured to converge the laser light at the object to be processed; and an imaging optical system constituting a double telecentric optical system in which a reflective surface of the reflective spatial light modulator and an entrance pupil plane of the converging optical system are in an imaging relationship.

Laser machining device and laser output device

There is provided a laser processing method for cutting a semiconductor object along a virtual plane facing a surface of the semiconductor object in the semiconductor object. The laser processing method includes a first step of forming a plurality of first modified spots along the virtual plane by causing laser light to enter into the semiconductor object from the surface, and a second step of forming a plurality of second modified spots along the virtual plane so as not to overlap the plurality of first modified spots, by causing laser light to enter into the semiconductor object from the surface.

A laser light irradiation device includes: a laser light source; a spatial light modulator including a display unit configured to display a phase pattern; an objective lens configured to condense a laser light emitted from the spatial light modulator at the object; an image-transfer optical system configured to transfer an image of the laser light on the display unit to an entrance pupil plane of the objective lens; a reflected light detector configured to detect reflected light of the laser light which is incident in the object and reflected by an opposite surface opposite to a laser light entrance surface; and a controller configured to control the phase pattern. When the reflected light detector detects the reflected light, the controller displays a reflected light aberration correction pattern which is the phase pattern correcting aberration generated in the event of the laser light being transmitted through the object having twice the predetermined thickness.

Laser light radiation device and laser light radiation method

A laser machining device includes a laser light source, a spatial light modulator which includes a display unit, an objective lens, an image-transfer optical system, a camera and a controller. The controller executes first display processing and second display processing. According to first display processing, when the camera captures the image, the display unit displays a first phase pattern for adjusting a condensing position of laser light condensed by the objective lens to a first condensing position. According to second display processing, when the camera captures the image, the display unit displays a second phase pattern for adjusting the condensing position of the laser light condensed by the objective lens to a second condensing position different from the first condensing position in an irradiation direction of the laser light.

There is provided a laser processing device that includes a laser light source configured to output laser light, a spatial light modulator configured to modulate the laser light output from the laser light source according to a phase pattern and emit the modulated laser light, an objective lens configured to converge the laser light emitted from the spatial light modulator onto an object, a controller configured to control a phase pattern to be displayed on the spatial light modulator, and a determiner configured to determine whether operation of the spatial light modulator is normal, in which the controller performs switching control in which the phase pattern to be displayed on the spatial light modulator is switched, and the determiner makes the determination on the basis of a change in intensity of the laser light emitted from the spatial light modulator between before the switching control and after the switching control.

Laser processing device and operation checking method

A laser processing device includes: a laser light source emitting laser light; a converging optical system converging the laser light at an object to be processed; a reflective spatial light modulator modulating the laser light such that the laser light is caused to branch into 0th order light and &#xb1;nth order light (n is a natural number) including at least first processing light and second processing light, and the first processing light is converged at a first converging point and the second processing light is converged at a second converging point; and a light blocking part blocking light to be converged at an outside with respect to the first processing light and the second processing light of the 0th order light and the &#xb1;nth order light to be converged at the object.

Laser machining device and laser machining method

An autocorrelation measurement device includes a first reflection member, a second reflection member, a focusing unit, a nonlinear optical crystal, a detection unit, a filter, an aperture, a delay adjusting unit, and an analysis unit. Incident pulsed light is transmitted through the second reflection member and incident on the first reflection member. First pulsed light reflected on a first reflection surface of the first reflection member and a second reflection surface of the second reflection member and second pulsed light reflected on a second reflection surface of the first reflection member and a first reflection surface of the second reflection member are incident on the nonlinear optical crystal via the focusing unit. Second harmonic light generated in the nonlinear optical crystal is detected by the detection unit.

Autocorrelation measurement device

A laser processing device includes: a laser light source; a converging optical system; and a reflective spatial light modulator modulating the laser light such that the laser light is caused to branch into at least first processing light and second processing light, and the first processing light is converged at a first converging point and the second processing light is converged at a second converging point. In a case in which Wis a radius of the first processing light at a front face of the object, Wis a radius of the second processing light at the front face, and D is a distance between the first converging point and the second converging point when viewed from a direction orthogonal to the front face, the reflective spatial light modulator modulates the laser light such that D&#x3e;W+Wis satisfied.

A collimation evaluation device includes a first reflection member, a second reflection member, a screen, and a housing. A first reflection surface of the first reflection member and a first reflection surface of the second reflection member face each other and are parallel to each other. Further, interference fringes are formed on the screen by light Lreflected on the first reflection surface of the first reflection member and a second reflection surface of the second reflection member and light Lreflected on a second reflection surface of the first reflection member and the first reflection surface of the second reflection member, and collimation of incident light is evaluated on the basis of a direction of the interference fringes.

Collimation evaluation device and collimation evaluation method

A laser processing apparatusis an apparatus for forming a modified region R in an object to be processed S by irradiating the object S with laser light L. The laser processing apparatuscomprises a laser light sourcethat emits the laser light L, a mount tablethat supports the object S, and an optical systemthat converges a ring part surrounding a center part including an optical axis of the laser light L in the laser light L emitted from the laser light sourceat a predetermined part of the object S supported by the mount table. The optical systemadjusts a form of at least one of inner and outer edges of the ring part of the laser light L according to a position of the predetermined part in the object S.

A first reflection member, when light is incident, reflects a part of the light by a first reflection surface, reflects light transmitted through the first reflection surface by a second reflection surface, and emits reflected light components in an opposite direction. The second reflection member, when light emitted from the first reflection member is incident, reflects a part of the light by a first reflection surface, reflects light transmitted through the first reflection surface by a second reflection surface, and emits reflected light components. Interference fringes are formed on a screen by light reflected on the first reflection surface of the first reflection member and the second reflection surface of the second reflection member and light reflected on the second reflection surface of the first reflection member and the first reflection surface of the second reflection member.

Growing community of inventors

Hamamatsu, Japan

Yasunori Igasaki