Okuno Chemical Industry Co., Ltd.

Yasunori Arisato

Yukikazu Moritsu

Nobuyuki Konaga

Yoshito Akai

Shigemitsu Kawagishi

Masatoshi Wada

Hideaki Koriyama

This invention provides a glass composition for joining ceramic articles to ceramic or metallic articles, the composition comprising:

Metal coated ceramic composition

Catalyst composition for forming electroless plating on ceramics

A composition for chemical copper plating having a pH of 12 to 14 and containing a boron hydride compound serving as a reducing agent, a water-soluble copper compound and a copper complexing agent, the composition being characterized in that the copper complexing agent is at least one of hydroxyalkyl-substituted ethylenediamines represented by the formula ##STR1## wherein R.sub.1, R.sub.2, R.sub.3 and R.sub.4 are the same or different and are each unsubstituted lower alkyl or hydroxyl- and/or carboxyl-substituted lower alkyl, and at least one of R.sub.1, R.sub.2, R.sub.3 and R.sub.4 is hydroxyl-substituted lower alkyl, and hydroxyalkyl-substituted diethylenetriamines represented by the formula ##STR2## wherein R.sub.5, R.sub.6, R.sub.7 and R.sub.8 are the same or different and are each unsubstituted lower alkyl or hydroxyl-and/or carboxyl substituted lower alkyl, R.sub.9 is hydrogen or unsubstituted lower alkyl or hydroxyl-and/or carboxyl-substituted lower alkyl, and at least one of R.sub.5, R.sub.6, R.sub.7, R.sub.8 and R.sub.9 is hydroxyl-substituted lower alkyl.

Compositions for chemical copper plating

Electrolytic stripping bath for removing metal coatings from stainless steel base material comprising at least one reducing compound selected from the group consisting of dimethylformamide, formaldehyde, thiosulfates, sulfites, hydrazine, hydroxylamine and dimethylaminoboron with the conventional compounds and having a pH of 6.0 to 9.5.

Electrolytic stripping bath for removing metal coatings from stainless

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Katano, Japan

Yasunori Arisato