Tokyo Electron Limited

Yasunobu Suzuki

Atsushi Gomi

Kanto Nakamura

Yasuhiko Kojima

Shinji Furukawa

Hiroshi Sone

Toshiharu Hirata

Tatsuo Hirasawa

Yusuke Suzuki

Chiaki Yasumuro

Koichi Takatsuki

Atsushi Shimada

Toru Kitada

Tooru Kitada

Keisuke Sato

A film forming apparatus for performing film formation on a substrate comprises a processing chamber, a stage configured to place thereon a substrate disposed in the processing chamber, a film forming part configured to perform film formation on the substrate placed on the stage, a shutter that is movable between a shielding position where the substrate on the stage is shielded and a retracted position retracted from the stage and where the film forming part performs the film formation on the substrate, and a film thickness measuring part. The film thickness measuring part has a film thickness measuring device configured to measure a film thickness of a film formed on the shutter at the shielding position by the film forming part.

Film forming apparatus and film forming method

In a method for setting a mounting position of a target substrate, the test substrate is transferred to a second position deviated from a first position. A mask has expected arrangement position where a non-film formation region has a preset width when the target substrate is mounted at the first position and subjected to a film formation. The film is formed on the test substrate at the second position by using the mask. Width of the non-film formation region formed on the test substrate after the film formation is measured. Actual arrangement position of the mask is specified based on a direction and a distance of the deviation of the second position from the first position and the measured width of the non-film formation region. The first position is corrected such that the non-film formation region has the preset width based on the actual arrangement position of the mask.

Method for setting mounting position of target substrate and film forming system

A deposition device according to one embodiment includes a processing container. A mounting table is installed inside the processing container, and a metal target is installed above the mounting table. Further, a head is configured to inject an oxidizing gas toward the mounting table. This head is configured to move between a first region that is defined between the metal target and a mounting region where a target object is mounted on the mounting table and a second region spaced apart from a space defined between the metal target and the mounting region.

Deposition device and deposition method

A film forming system includes a camera having a field of view in a region through which an edge of a film-formed workpiece rotated by a rotational stage and an edge of the film of the film-formed workpiece pass. Based on three or more images obtained by the camera during the rotation of the film-formed workpiece, widths between the edge of the film-formed workpiece and the edge of the film of the film-formed workpiece at circumferentially different locations are obtained. Based on the widths obtained by the first unit, a first positional deviation of a central position of the film of the film-formed workpiece with respect to a central position of the film-formed workpiece is obtained. By using the first positional deviation of the film-formed workpiece, a transfer position of a transfer modules transferring the workpiece to a film forming apparatus used for producing the film-formed workpiece is corrected.

Film forming system

A film forming apparatus, for forming a metal oxide film on an object, includes a holding unit and a heating unit. The holding unit includes a first heater and holds the object in a processing chamber. A first heater power supply supplies power to the first heater. A target electrode is electrically connected to a metal target provided above the holding unit. A sputtering power supply is electrically connected to the target electrode. An introduction mechanism supplies an oxygen gas toward the holding unit. The heating unit includes a second heater for heating the object and a moving mechanism for moving the second heater between a region in a first space disposed above the holding unit and a region in a second space separated from the first space. A second heater power supply supplies power to the second heater.

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Yamanashi, Japan

Yasunobu Suzuki