Daicel Corporation

Nichia Corporation

Yasunobu Nakagawa

Shigeaki Kamuro

Shinya Yabuno

Masafumi Kuramoto

Satoru Ogawa

Ryo Itaya

Takeshi Yoshida

Masahide Bando

Provided is a curable resin composition which can be cured to form a material (cured product) that has low tack properties and resists adhesion of garbage. The present invention provides a curable resin composition comprising polysiloxane (A) having not less than 2 alkenyl groups in the molecule and polysiloxane (B) having not less than 2 hydrosilyl groups in the molecule, wherein (T+Q)/D>0.3 and M+D+T+Q=1 are satisfied regarding all silicon atoms contained therein, the amount of the hydrosilyl groups with respect to 1 mol of aliphatic carbon-carbon double bonds present therein is 0.9 to 5.0 mol, and a cured product of the curable resin composition exhibits a separation strength of not more than 0.40 N per mmin separation load evaluation and/or a total separation load of not more than 0.018 N·mm per mm.

Curable resin composition, method for producing curable resin composition, and method for measuring surface tackiness of viscoelastic material

The purpose of the present invention is to provide a curable resin composition which forms a cured product having excellent heat resistance, light resistance, and flexibility. The present invention provides a curable resin composition comprising the following components:

Curable resin composition, cured product of same and semiconductor device

An objective of the present invention is to provide a curable resin composition for forming a cured product having excellent heat resistance, light resistance, flexibility, and toughness. The present invention provides a curable resin composition containing the following components in specific blended amounts.

Curable resin composition, cured product thereof, and semiconductor device

An object of the present invention is to provide a curable resin composition for forming a less tacky cured product, having excellent gas barrier properties and heat and light resistance. This curable resin composition comprises the following components (A), (B), and (C): (A): a polyorganosiloxane represented by the following average unit formula:(SiO)(RSiO)(RSiO)(RSiO)wherein each Ris alkyl, aryl, alkenyl, etc., a percentage of the alkyl is 50 to 98 mol %, a percentage of the aryl is 1 to 50 mol %, and a percentage of the alkenyl is 1 to 35 mol % based on the total amount of R, and a1&#x3e;0, a2&#x3e;0, a3&#x2265;0, a4&#x3e;0, 0.5&#x2264;a1/a2&#x2264;10, and a1+a2+a3+a4=1;(B) a polyorganosiloxane represented by the following average composition formula:RHSiOwherein Ris alkyl or aryl, and 0.7&#x2264;m&#x2264;2.1, 0.001&#x2264;n&#x2264;1.0, and 0.8&#x2264;m+n&#x2264;3; and(C): a hydrosilylation catalyst.

An object of the present invention is to provide a curable resin composition for forming a less tacky cured product having excellent gas barrier properties, heat resistance, light resistance, flexibility and heat shock resistance. The curable resin composition comprises the following components (A), (B), (C), and (D), wherein a content of the component (C) is 0.3 to 20 wt %, based on the total amount of the composition: (A): a polyorganosiloxane represented by an average unit formula: (SiO)(RSiO)(RSiO)(RSiO), wherein each Ris alkyl, aryl, alkenyl, etc., and a percentage of the alkyl is 50 to 98 mol %, a percentage of the aryl is 1 to 50 mol %, and a percentage of the alkenyl is 1 to 35 mol %, based on the total amount of R, and a1&#x3e;0, a2&#x3e;0, a3&#x2265;0, a4&#x3e;0, 0.5&#x2264;a1/a2&#x2264;10, and a1+a2+a3+a4=1;(B): a polyorganosiloxane represented by an average composition formula: RHSiOwherein Ris alkyl or aryl, and 0.7&#x2264;m&#x2264;2.1, 0.001&#x2264;n&#x2264;1.0, and 0.8&#x2264;m+n&#x2264;3;(C): a straight-chain polyorganosiloxane represented by a general formula (III-1): wherein Ris alkyl, and y is an integer of not less than 1 and not more than 100; and(D): a hydrosilylation catalyst.

Provided is a curable resin composition which can be cured to form a material (cured product) that has low tack properties and resists adhesion of garbage. The present invention provides a curable resin composition comprising polysiloxane (A) having not less than 2 alkenyl groups in the molecule and polysiloxane (B) having not less than 2 hydrosilyl groups in the molecule, wherein (T+Q)/D&#x3e;0.3 and M+D+T+Q=1 are satisfied regarding all silicon atoms contained therein, the amount of the hydrosilyl groups with respect to 1 mol of aliphatic carbon-carbon double bonds present therein is 0.9 to 5.0 mol, and a cured product of the curable resin composition exhibits a separation strength of not more than 0.40 N per mmin separation load evaluation and/or a total separation load of not more than 0.018 N&#xb7;mm per mm.

Provided is a curable resin composition capable of forming a cured product that has excellent heat resistance and transparency and, in particular, offers excellent barrier properties to a corrosive gas. The curable resin composition according to the present invention includes a polyorganosiloxane (A), an isocyanurate compound (B), and a silane coupling agent (C). The polyorganosiloxane (A) is an aryl-containing polyorganosiloxane. The polyorganosiloxane (A) preferably includes a polyorganosiloxane having a number-average molecular weight (Mn) of 500 to 4000 as determined by gel permeation chromatography and calibrated with a polystyrene standard.

Curable resin composition and cured product thereof, encapsulant, and semiconductor device

The curable resin composition according to the present invention includes a polyorganosiloxane (A), a silsesquioxane (B), an isocyanurate compound (C), and a silane coupling agent (D). The polyorganosiloxane (A) is a polyorganosiloxane approximately devoid of aryl groups. The silsesquioxane (B) includes a ladder-like silsesquioxane. The curable resin composition has excellent heat resistance, transparency and flexibility. It offers superior reflow resistance and barrier properties to a corrosive gas.

Curable resin composition, and cured product of same

Provided is a curable resin composition capable of forming a cured product which has excellent heat resistance, transparency, and flexibility and particularly excels in reflow resistance and barrier properties to a corrosive gas. The curable resin composition includes a ladder-type polyorganosilsesquioxane and an isocyanurate compound such as a triglycidyl isocyanurate compound, a monoallyl diglycidyl isocyanurate compound, a diallyl monoglycidyl isocyanurate compound, or a triallyl isocyanurate compound.

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Ohtake, Japan

Yasunobu Nakagawa