Mitsubishi Heavy Industries Limited

Yasunobu Ishida

Akihiro Terasaka

Koichi Hasegawa

Jun Eto

Yuichi Yui

Kenji Wada

Yoshifusa Tobata

A fitting method is for fitting a material to be repaired and a repair patch to be adhesively bonded to the material at adhesive surfaces, each adhesive surface having at least two or more of curved portions. The fitting method includes measuring a shape of the material; measuring a shape of the repair patch; dividing repair patch shape measurement data acquired at measuring the shape of repair patch into pieces of divided data each including one or less of the curved portions; performing, at the adhesive surfaces, fitting processing of the pieces of divided data acquired at dividing the repair patch shape measurement data to material-to-be-repaired shape measurement data acquired at measuring the shape of material; and calculating a gap amount between the material-to-be-repaired shape measurement data and repair patch shape fitting data acquired from the fitting processing at the adhesive surfaces.

Fitting method and repair method

The bonding apparatus of the present invention is an apparatus that bonds a patch containing a reinforcing fiber to a bonded section of a corner section CR of an object member. The bonding apparatus has s heater mat, a pushing member, a bag member having a decompression port, a mold releasing film, a breather, a heater mat and a sealant. A pushing member has a first cowl plate, a second cowl plate and an elastic pressuring body. A pressuring section of the pushing member has the surface shape corresponding to a corner section design value after the patch is bonded. By protruding from a gap between a first cowl plate and a second cowl plate to a direction of the corner section CR, the patch is pushed to the bonded section and the generation of a wrinkle in the reinforcing fiber can be prevented.

Bonding apparatus and bonding method

Growing community of inventors

Tokyo, Japan

Yasunobu Ishida