Mitsubishi Gas Chemical Company, Inc.

Shin-etsu Chemical Co., Ltd.

Yasumasa Norisue

Daisuke Ohno

Makoto Miyamoto

Kenji Ishii

Kiyonari Hiramatsu

Katsutoshi Yamazaki

Akikazu Amagai

Makoto Yamazaki

Kenzi Ishii

Masahiro Johno

Michio Nawata

Atsushi Hirashima

Takakiyo Mine

Hideo Uno

Masaaki Yamaya

Masaki Tanaka

Jun Nakano

Fumiya Zaima

Akinari Itagaki

Yuki Motoyama

Mutsuhiko Takeda

Yoshinori Kondo

Masamichi Mizukami

Isao Hagiwara

Goro Shimaoka

Seiji Shika

Takahiro Adachi

Mitsuru Nozaki

Satoshi Kanayama

Takeru Horino

Ryu Iwasaki

Hiroshi Murayama

Masamitchi Mizukami

Yasue Ogi

Katsuhiko Yanagida

A process, advantageous in producibility, for the production of a vinyl compound containing very small amounts of ionic impurities and hydrolysable halogens, which is capable of curing by means of heat and/or light and giving a cured product having excellent dielectric characteristics and heat resistance, which process can efficiently remove a generated salt and comprises reacting a non-protonic polar solvent solution of a specific bifunctional phenylene ether oligomer with a vinylbenzyl halide in the presence of an alkoxide of an alkali metal,

Process for the production of vinyl compound

The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.

Cyanate-terminated polyphenylene ether

Carboxylic acid-modified bisphenol epoxy di(meth)acrylate

(Meth)acrylated epoxy-terminated polyphenylene ether

A curable resin composition containing as essential components a high molecular weight compound having a weight average molecular weight of at least 10,000 and a vinyl compound of the formula (1). 

Curable resin composition, curable film and cured film

An alkali metal or alkaline earth metal salt of sulfonic acid of polyphenylene ether oligomer is useful as a modifier for thermoplastic resins, typically as a flame retardant, compatibilizing agent or antistatic agent.

Polyphenylene ether oligomer sulfonic acid salt, making method, flame retardant resin composition, and molded article

A bifunctional phenylene ether oligomer of the formula (1), obtained by oxidation polymerization of a bivalent phenol of the formula (2) and a monovalent phenol of the formula (3),HO&#x2014;YO&#x2014;X&#x2014;OY&#x2014;OH &#x2003;&#x2003;(1)HO&#x2014;X&#x2014;OH &#x2003;&#x2003;(2)Y&#x2014;OH &#x2003;&#x2003;(3) and Y&#x2014;O&#x2014; is represented by the formula (3), 

Carboxylic acid-modified biphenyl epoxy diacrylate

(Meth)acrylate-terminated polyphenylene ether

A bifunctional phenylene ether oligomer containing monophenylene and biphenylene moieties can be rendered thermosetting by reacting the terminal phenolic hydroxyl groups with a) a cyanogen halide to introduce terminal cyanate groups, b) a halogenated glycidyl to form terminal epoxy groups, or c) an allyl halide to produce allylic terminal groups. The epoxy-terminated phenylene ether oligomer can be further reacted acrylic and/or methacrylic acid to yield an epoxy di(meth)acrylate which can be further modified with a carboxylic acid or anhydride to obtain and acid-modified epoxy di(meth)acrylate.

Di(meth)acrylate of epoxy-terminated polyphenylene ether

Polyphenylene ether oligomer compound, derivatives thereof and use thereof

A bifunctional phenylene ether oligomer of the formula (1), obtained by oxidation polymerization of a bivalent phenol of the formula (2) and a monovalent phenol of the formula (3),  and Y&#x2014;O&#x2014; is represented by the formula (3), 

Bifunctional phenylene ether oligomer, its derivatives, its use and process for the production thereof

An acid anhydride of the formula (4), and a polyimide using the acid anhydride,  

Acid anhydride and polyimide using the same

A process for the production of a vinyl compound of the formula (1),  

A resin composition for a laminate, containing at least 10% by weight of a vinyl compound represented by the formula (1), and a prepreg and a metal-clad laminate using the resin composition. 

Resin composition and prepreg for laminate and metal-clad laminate

A curable resin composition containing a polyfunctional cyanate ester resin and a bifunctional phenylene ether oligomer having a number average molecular weight of 500 to 3,000 and having a specific structure represented by the formula (1), and a cured product thereof. H&#x2014;O&#x2014;YO&#x2014;X&#x2014;OY&#x2014;O&#x2014;H&#x2003;&#x2003;(1)

Curable resin composition and cured product thereof

Growing community of inventors

Tokyo, Japan

Yasumasa Norisue