Tokuyama Corporation

Dowa Metaltech Co., Ltd.

Yasuko Takeda

Junji Momoda

Hideyo Osanai

Shinobu Izumi

Hironobu Nagoh

Yukihiro Kanechika

Yuichiro Kawabata

Reo Yamamoto

Yukihiro Kitamura

Ken Sugawara

Hiroki Yokoyama

Hiroto Aoki

After a wet blasting treatment for jetting a slurry, which contains spherical alumina as abrasive grains in a liquid, to the surface of a ceramic substrateof aluminum nitride sintered body so that the ceramic substratehas a residual stress of not higher than &#x2212;50 MPa and so that the surface of the ceramic substrateto be bonded to the metal platehas an arithmetic average roughness Ra of 0.15 to 0.30 &#x3bc;m, a ten-point average roughness Rz of 0.7 to 1.1 &#x3bc;m and a maximum height Ry of 0.9 to 1.7 &#x3bc;m while causing the ceramic substrate to have a flexural strength of not higher than 500 MPa and causing the thickness of a residual stress layerformed along the surface of the ceramic substrateto be 25 &#x3bc;m or less, the metal plateof copper or a copper alloy is bonded to the ceramic substrate, which is obtained by the wet blasting treatment, via a brazing filler metalto produce a metal/ceramic bonding substrate which has an excellent bonding strength of the ceramic substrateto the metal plateand which has an excellent heat cycle resistance.

Metal/ceramic bonding substrate and method for producing same

A substrate for device bonding includes a substrate having an electrode layer and a solder layer formed on the electrode layer, wherein the solder layer is a Pb-free solder layer which comprises (1) a base metal composed of (i) Sn, (ii) Sn and Au, or (iii) In, (2) at least one metal selected from the group consisting of Bi, In (only in the case where the base metal is Sn, or Sn and Au), Zn, Au (only in the case where the base metal is In) and Sb, and (3) at least one metal selected from the group consisting of Ag, Ni, Fe, Al, Cu and Pt, and the solder layer has a thickness of 1 to 15 &#x3bc;m and a surface roughness (Ra) of not more than 0.11 &#x3bc;m.

Substrate for device bonding, device bonded substrate, and method for producing same

Novel chromene compounds having various substituents to exhibit a high color-developing sensitivity and a high density even when dispersed in a high-molecular matrix, and exhibiting a large fading rate, less color when deteriorated, and excellent light resistance in the photochromic properties; photochromic materials containing the chromene compounds; and use thereof.

Chromene compound

Growing community of inventors

Ibaraki, Japan

Yasuko Takeda