Asahi Glass Company, Limited

Lion Corporation

Yasuko Osaki

Katsuyoshi Nakayama

Nobuhiro Nakamura

Kenji Imakita

Kazunari Watanabe

Naoya Wada

Hitoshi Onoda

Tsuneo Manabe

Syuji Matsumoto

Akihiro Hishinuma

Hiroyuki Yamamoto

Kazuhiro Ito

Hideaki Hayashi

Jiro Chiba

Shoji Watanabe

Hiroshi Usui

Yumiko Aoki

Satoshi Fujimine

Shigeyoshi Kobayashi

Toshihisa Okada

Hirosi Usui

Shiro Ohtaki

Shinji Honda

Takashi Ootsuki

Shotaro Watanabe

Naoyuki Tsuda

Yumi Okuyama

Rui Yanagawa

Masazumi Shigematsu

Kazuyoshi Orihara

Tohoru Sema

Provided is a light-emitting device provided with a light reflection layer which has a high light reflectivity and which is less susceptible to deterioration of the reflectivity due to corrosion, and having an improved light extraction efficiency. A light-emitting device comprising a substrate having a conductor layer formed on its surface and a light-emitting element disposed on the conductor layer, characterized in that an overcoat layer is formed between the conductor layer and the light-emitting element, and the overcoat layer is a borosilicate glass which comprises, as represented by mol % based on oxides, from 62 to 84% of SiO, from 10 to 25% of BO, from 0 to 5% of AlOand from 0 to 5% in total of at least one of NaO and KO, provided that the total content of SiOand AlOis from 62 to 84%, and may contain from 0 to 10% of MgO and at least one of CaO, SrO and BaO in a total content of at most 5%.

Light-emitting device

The present invention relates to an organic LED element sequentially including: a transparent substrate; a scattering layer; a first electrode; an organic layer; and a second electrode, in which the scattering layer includes a first glass material and a second glass material dispersed in the first glass material and having a different refractive index from the first glass material.

Organic LED element, glass frit for diffusion layer for use in organic LED element, and method for production of diffusion layer for use in organic LED element

To provide a light emitting diode package of which the height of protrusion of a thermal via is decreased without decreasing the flexural strength of an insulating substrate. A light emitting diode package comprising a light emitting diode element mounted on a substrate, wherein the substrate is obtained by firing a glass ceramic composition containing a powder of glass containing, as represented by mole percentage, from 57 to 65% of SiO, from 13 to 18% of BO, from 9 to 23% of CaO, from 3 to 8% of AlOand from 0.5 to 6% of at least one of KO and NaO in total, and a ceramic filler.

Light emitting diode package

To provide glass with which a sealing treatment can be carried out at a temperature of at most 400&#xb0; C. and which does not deteriorate or change in quality for a long time. Glass comprising, as represented by mol % based on oxides, from 27 to 33% of PO, from 50 to 70% of SnO, from 0 to 10% of ZnO, from 0.5 to 5% of CaO and from 0 to 5% of BO.

Glass, coating material for light-emitting devices and light-emitting device

A lead-free glass for covering electrodes including, as represented by mass % based on the following oxides, from 30 to 50% of BO, from 21 to 25% of SiO, from 10 to 35% of ZnO, from 7 to 14% in total of KO and either one or both of LiO and NaO, from 0 to 10% of AlO, and from 0 to 10% of ZrO, wherein when it contains at least one component selected from the group consisting of MgO, CaO, SrO and BaO, the total of their contents is at most 5%, and when the molar fractions of LiO, NaO and KO are represented by l, n and k, respectively, l is at most 0.025, and l+n+k is from 0.07 to 0.17.

Process for producing electrode-formed glass substrate

A glass-covered light-emitting element and a glass-covered light-emitting device are provided, which are covered with a glass having a low glass transition point and a thermal expansion coefficient close to that of the light-emitting element. The glass-covered light-emitting element includes a semiconductor light-emitting element having a principal surface, and a PO&#x2014;ZnO&#x2014;SnO type glass covering the principal surface of the semiconductor light-emitting element, and the glass consists essentially of, as represented by mol % based on the following oxides, from 20 to 45% of PO, from 20 to 50% of ZnO and from 20 to 40% of SnO, and the glass has a glass transition point of at least 290&#xb0; C. and at most 450&#xb0; C., and a thermal expansion coefficient of at most 105&#xd7;10/&#xb0; C.

Glass for covering optical element, glass-covered light-emitting element and glass-covered light-emitting device

A method for producing a laminated dielectric, which comprises laminating a raw material layer containing a high dielectric constant glass ceramic composition comprising from 30 to 70 mass % of a Ba&#x2014;Ti compound powder having a Ti/Ba molar ratio of from 3.0 to 5.7 and from 30 to 70 mass % of an alkali free glass powder containing, by mol %, from 15 to 40% of SiO, from 5 to 37% of B2O3, from 2 to 15% of AlO, from 1 to 25% of CaO+SrO, from 5 to 25% of BaO and from 25 to 50% of SiO+AlO, and a raw material layer containing a low dielectric constant glass ceramic composition comprising from 10 to 70 mass % of a ceramic powder and from 30 to 90 mass % of an alkali free glass powder wherein SiO+AlOis at least 34 mol % and larger by at least 9 mol % than that in the above alkali free glass powder, followed by firing.

Method for producing laminated dielectric

A non-lead glass for forming a dielectric, which consists essentially of, as represented by mol %, from 20 to 39% of SiO, from 5 to 35% of BO, from 2 to 15% of AlO, from 1 to 25% of CaO+SrO, from 5 to 25% of BaO, from 0 to 35% of ZnO, and from 0 to 10% of TiO+ZrO+SnO, provided that BO+ZnO is from 15 to 45%, and which does not contain alkali metal oxides, or contains such oxides in a total amount within a range of less than 1%. Further, a glass ceramic composition for forming a dielectric, which consists essentially of a Ba-containing compound powder and a powder of the above mentioned non-lead glass for forming a dielectric. Further, a dielectric obtained by firing the above glass ceramic composition for forming a dielectric.

Non-lead glass for forming dielectric, glass ceramic composition for forming dielectric, dielectric, and process for producing laminated dielectric

A glass ceramic composition which consists essentially of an inorganic material powder having a melting point or a glass transition point of at least 1,000&#xb0; C. and a glass powder having a glass transition point of from 450 to 800&#xb0; C., wherein the average of the major axes L of particles of the above inorganic material powder is from 0.5 to 15 &#x3bc;m, and the average of the ratios L/W of the major axes L to the minor axes W is at most 1.4. Further, a glass ceramic composition which consists essentially of, as represented by mass percentage, from 10 to 58% of an inorganic material powder having a melting point or a glass transition point of at least 1,000&#xb0; C. and from 42 to 90% of a glass powder having a glass transition point of from 450 to 800&#xb0; C., wherein the glass powder consists essentially of, as represented by mol %, SiO: 35 to 70%, BO: 0 to 30%, AlO: 3 to 18%, MgO: 0 to 40%, CaO: 0 to 19%, BaO: 0 to 35% and ZnO: 0 to 9%.

Glass ceramic composition

A calcium phosphate type glass-ceramic which comprises from 64 to 72% by weight of phosphorus oxide in terms of P.sub.2 O.sub.5, from 13 to 20% by weight of calcium oxide in terms of CaO, from 6 to 13% by weight of strontium oxide in terms of SrO, and from 3 to 15% by weight in total of at least one member selected from the group consisting of aluminum oxide, cerium oxide and lanthanum oxide respectively in terms of Al.sub.2 O.sub.3, Ce.sub.2 O.sub.3 and La.sub.2 O.sub.3, a molar ratio of (CaO+SrO)/P.sub.2 O.sub.5 being 0.78-0.86.

Calcium phosphate type glass-ceramic

A mold capable of imparting uniform transparency to the calcium phosphate type crystallized glass, in which crystals of calcium metaphosphate are present at the shaping surface of the mold which comes into contact with the material to be shaped.

Molding method

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Tokyo, Japan

Yasuko Osaki