Nippondenso Co., Ltd.

Nippendenso Co., Ltd.

Yasuki Shimoyama

Masahito Imai

Tiaki Mizuno

Masaki Takakuwa

Horonobu Baba

Yuichi Yokoyama

Hiromi Ariyoshi

Naohito Mizuno

Shinichi Hirose

When a compressed air is led into a reference pressure chamber along with a boundary between a resin housing and a terminal, such compressed air may cause a wire breaking. A barrier wall for blocking the compressed air from penetrating toward the wire is disposed. The reference pressure chamber is divided into a main chamber and a subchamber by the barrier wall. Since the barrier wall blocks the compressed air, the compressed air can not reach a silicon gel in the main chamber. Therefore, the wire breaking caused by the compressed air when connecting a connector therewith can be precluded.

Pressure sensor

A pressure sensor has a resin housing containing a pressure sensor positioned between a reference pressure chamber and a pressure to be measured. A terminal extends through the housing toward the sensor. A wire connects the terminal to the sensor. When a connector is connected to the terminal, it may compress air around the terminal. The compressed air may travel along the terminal and break the wire connected to the sensor. To prevent such breakage, a barrier wall is provided to block the compressed air from penetrating toward the wire. The reference pressure chamber is divided into a main chamber and a subchamber by the barrier wall. Since the barrier wall blocks the compressed air, the compressed air can not reach a silicon gel on the sensor and the wire in the main chamber. Therefore, the wire is protected.

Pressure sensor with barrier in a pressure chamber

An acceleration detecting device, which can be constructed simply and allow compactness, is disclosed. A cover is installed on a housing-body portion to form a hollow portion, and a sensor chip which is subjected to acceleration and displaced is bonded and fixed within this hollow portion. This housing-body portion has a flat end face, and electrical wiring leads and electrically connected to the sensor chip is formed on the end face via the interior of the housing-body portion. This end face is electrically and mechanically connected to a circuit board by a bonding agent, and the housing-body portion is fixed to the circuit board substantially perpendicularly.

Physical-quantity detecting device

Growing community of inventors

Nukata-gun, Japan

Yasuki Shimoyama