Denso Corporation

Yasuki Shimoyama

Tomohito Kunda

Tetsuo Fujii

Minekazu Sakai

Kenichi Ao

Seiichiro Ishio

Minoru Murata

Shinji Yoshihara

Kinya Atsumi

Norio Kitao

Sumitomo Inomata

A physical quantity sensor detecting physical quantity, such as acceleration or angular velocity, is provided and mounted on, for example, a vehicle. The sensor has a physical quantity transducer and the first to third circuits. The transducer senses physical quantity acting in a direction determined with respect to a predetermined detection axis of the transducer to output a detection signal corresponding in level to the physical quantity. The first circuit receives the detection signal and output a first physical quantity signal depending in level on the detection signal. The second circuit produces a second physical quantity signal from the first physical quantity signal, the second physical quantity signal being larger in magnitude the first physical quantity signal. The third circuit receives the first and second physical quantity signals and outputs a signal consisting of the first and second physical quantity signals alternately selected and lined up sequentially in time.

Physical quantity sensor capable of outputting time-serial signal indicative of plural ranges of physical quantity

A semiconductor sensor chip is provided with a weight portion supported in a frame via beams whereby acceleration up to substantially &plusmn;1 G can be detected by utilizing piezoresistance effect of resistor elements formed on the beams. The semiconductor sensor chip is supported by a seat having a thermal expansion coefficient equivalent to that of the semiconductor sensor chip via the frame. The frame and the seat are adhered to each other by a flexible adhesive agent mixed with a plurality of resin beads functioning as spacers and under an adhesion state, air damping of the weight portion is carried out by setting a dimension of an air gap between the weight portion and the seat to a range of 7 through 15 &mgr;m.

Semiconductor acceleration sensor

A heat resisting resin sheet is bonded to a semiconductor chip as a protective cap for protecting a beam structure provided on the semiconductor chip, through a heat resisting adhesive. The heat resisting resin sheet is composed of a polyimide base member and the heat resisting adhesive is composed of silicone adhesive. The heat resisting resin sheet is not deformed during a manufacturing process of the semiconductor chip. In addition, grinding water does not invade into the semiconductor chip during dicing-cut.

Semiconductor device with a protective sheet to affix a semiconductor chip

Growing community of inventors

Anjo, Japan

Yasuki Shimoyama