Lintec Corporation

Panasonic Corporation

Kyushu University

Yasukazu Nakata

Taiga Matsushita

Yuichi Iwakata

Hideo Senoo

Kazuya Katoh

Masateru Yamakage

Hiroshi Yamamoto

Chihaya Adachi

Satoshi Sakurai

Takeshi Kondo

Akira Ichikawa

Toshio Sugizaki

Manabu Nakata

Naoki Hasegawa

Takashi Sugino

Katsuhisa Taguchi

Takashi Matsushita

Tomio Hatanaka

Katsuyoshi Matsuura

Takakazu Murakami

Kazuaki Morita

Yoshio Nikawa

Kenji Nishio

Kenichi Kashiwagi

A pressure-sensitive adhesive composition including an addition reaction type silicone polymer as a component (A); an ultraviolet absorber as a component (B); and a platinum group metal catalyst as a component (C). The ultraviolet absorber as the component (B) includes a benzophenone-based ultraviolet absorber and its amount is set to a value within the range of 1 part to 4 parts by weight relative to 100 parts by weight of the addition reaction type silicone polymer as the component (A). The amount of the platinum group metal catalyst as the component (C) is set to a value within the range of 0.001 parts to 0.05 parts by weight relative to 100 parts by weight of the addition reaction type silicone polymer as the component (A).

Adhesive composition and adhesive sheet

An organic EL element comprises: a substrate; a first electrode formed at one surface side of the substrate; a second electrode opposing the first electrode; and an organic EL layer located between the first and second electrodes. In the organic EL element, the second electrode is a transparent electrode, and the first electrode is a reflecting electrode. The organic EL element is a top-emission type. The first electrode comprises a plurality of nanometer-size (nanometer-order) columnar structures formed on the above-mentioned one surface of the substrate, and each of the plurality of columnar structures has a metallic surface as the outermost surface.

Organic EL element and method for manufacturing same

A light transmissible solar cell module including: solar cell units, which include a transparent substrate, a mirror electrode layer provided on a part of a surface of the transparent substrate, and a solar cell section provided on the mirror electrode layer, arranged in multi-levels; a first connecting wire electrically connected to an electrode provided on a surface side of the solar cell section; and a second connecting wire electrically connected to the mirror electrode layer, wherein the solar cell units are arranged so that a light entering from one side hits the solar cell section of an arbitrary solar cell unit and is reflected, and the reflected light reaches another side by being reflected by the mirror electrode layer of a solar cell unit arranged adjacent to the arbitrary solar cell unit.

Light transmissible solar cell module, process for manufacturing same, and solar cell panel thereof

The present invention discloses: an IC inletwhich comprises a substrate, a surface circuit including a plain coil circuit portionformed on the substrate and opposed electrodesandindividually connected with the two ends of the plain coil circuit portion, and an IC chipmounted in connection with the opposed electrodes, wherein a cut-away broken lineformed in at least a portion of the surface circuit so as to pass through the substrate and the surface circuit, and IC tag which is produced by the use of the IC inlet.

Antenna circuit, IC inlet and IC tag

The present invention provides a flip chip mounting substrate which comprises an electronic circuit composed of a circuit line and plural mounting pads connected to both ends of the circuit line formed on one surface of a base sheet, wherein the plural mounting pads are faced each other and spaced a pad clearance gap apart, and one or more semiconductor mounting paste guide paths are formed in the mounting pads. The flip chip mounting substrate can reduce voids that might be produced in the semiconductor mounting paste, when flip-chip-mounting an IC chip on a flip chip mounting substrate.

Flip chip mounting substrate

The present invention provides an IC tag which has a structure comprising a first adhesive layer laminated on a surface of a substrate sheet, an electronic circuit containing a circuit line having a bypass line and an IC chip connecting to the electronic circuit which are formed on a surface of the first adhesive layer, a second adhesive layer laminated for covering the electronic circuit and the IC chip, and a release agent layer formed partly at the position corresponding to a circuit section consisting of the electronic circuit and the IC chip and located at the interface between the substrate sheet and the first adhesive layer, wherein the angle formed by the tangent of the bypass line at the connection between the bypass line and the circuit line and the tangent of the circuit line at the connection is 10 degree or greater. When the IC tag attached to an article is peeled off, the built-in electronic circuit is surely broken.

IC tag

A process for producing a semiconductor device which comprises, in a process comprising mounting a semiconductor element in accordance with a flip chip bonding process, bonding the semiconductor element to a circuit board with a thermosetting resin, coating peripheral portions of the bonded semiconductor element with a photocurable resin and forming a fillet by photocuring the photocurable resin; and a semiconductor device comprising a semiconductor element mounted on a circuit board in accordance with a flip chip bonding process, wherein the semiconductor element is bonded to the circuit board with a thermosetting resin at portions directly under the semiconductor element, and a fillet is formed with a photocurable resin at peripheral portions of the semiconductor element. The semiconductor device can be efficiently produced in accordance with the flip chip bonding process and exhibits excellent resistance to heat and moisture and reliability.

Process for producing semiconductor device and semiconductor device

To present the ID tag including flat coil component, and characteristic adjusting method of ID tag capable of suppressing product fluctuations about the desired characteristic. The flat coil component of the ID tag of the invention comprises a flat coil composed of a conductive material provided continuously and spirally on an insulating substrate, and a jumper disposed on the flat coil with insulation, from one of inner end or outer end of this flat coil to the outside or inside of the flat coil where other end is positioned, in which the jumper is composed of a plurality of jumpers variable in the number of pieces in arrangement. The characteristic is adjusted by varying the number of effective pieces for forming the parallel arrangement.

Flat coil component, characteristic adjusting method of flat coil component, ID tag, and characteristic adjusting method of ID tag

Reinforcing material having Rockwell hardness of 60 or above and comprising base material and adhesive is formed, and then the reinforcing material is attached to one side of silicon wafer on which circuits are not formed prior to dicing.

Reinforcement material for silicon wafer and process for producing IC chip using said material

A card sealed by using a composition which includes an acrylate compound polymerizable by an ionizing radiation and 1 to 40 parts by weight of a polyfunctional isocyanate compound per 100 parts by weight of the acrylate compound and can be cured by irradiation of the ionizing radiation and a process for producing a card disposing a coating layer of the composition between a substrate sheet and a cover sheet and curing the coating layer by irradiation of an ionizing radiation.

Card and process for producing the card

An electric wave shielding material provided to be adhered to a window. The material includes a body member composed of a light transmitting surface material; a light transmitting electrically conductive layer provided on the light transmitting surface material; and a light transmitting adhesive provided on at least a part of the light transmitting electrically conductive layer in such a manner that a part of the light transmitting electrically conductive layer is exposed to form a connecting electrically conductive portion. A connecting piece composed of a member for converting an electric wave into a heat energy is connected to the connecting electrically conductive portion, and includes an adhesive layer.

Electric wave shielding material

A sheet antenna which comprises a substrate sheet, a layer of antenna element composed of a conductive material and a carbon-containing layer, the layer of antenna element and the carbon-containing layer being laminated on the substrate sheet is disclosed. The sheet antenna is superior in receiving and/or transmitting sensitivity of electric waves.

Sheet antenna

An adhesive composition comprising a pressure sensitive adhesive component (A), a thermosetting adhesive component (B) and a compound (C) obtained by addition/condensation reaction of a polysiloxane oligomer with a silane coupling agent. This composition is excellent in storage stability and can bond metals, etc. with large bonding strength. Further, sheeting thereof enables simplifying bonding steps.

Growing community of inventors

Tokyo, Japan

Yasukazu Nakata