Murata Manufacturing Co., Ltd.

Yamamoto Vinita Co., Ltd.

Nitta Corporation

Yasuji Yamamoto

Michio Kadota

Eiichi Takata

Toshimaro Yoneda

Masaaki Taniguchi

Takahiko Yoshida

Michiaki Inui

Kiyoshi Ogawa

Toshihiro Imahori

Yuichi Sugizaki

Tsuneo Nagata

Mikiya Shimizu

Takahiro Ishibashi

Junichi Kodama

Genji Inuidani

Yoshio Akesaka

A multilayer ceramic capacitor connected to an output electrode and an input electrode of a mounting substrate includes a laminated body. In the laminating direction of the laminated body, the shortest distance from an outer first internal electrode to the surface of an external electrode on the side closer to a first principal surface, and the shortest distance from an outer second internal electrode to the surface of an external electrode on the side closer to a second principal surface are each about 40 &#x3bc;m or less. In the width direction of the laminated body, the shortest distance from an end of an internal electrode to the surface of the external electrode on the side closer to a first side surface, and the shortest distance from an end of an internal electrode to the surface of the external electrode on the side closer to a second side surface are each about 40 &#x3bc;m or less.

Mounting substrate

Thawing is achieved by applying high-frequency power to a frozen material (R) sandwiched between opposing electrodes. A thawing section of a thawing apparatus () includes unit electrodes () for a first electrode group as a former stage, unit electrodes () for a second electrode group as a latter stage, and unit electrodes () for a third electrode group as a further stage. The unit electrodes () for the first electrode group are set so that the area of the electrode surface is smaller than the area of the sandwiched surface of the frozen material (R). The unit electrodes () for the second top electrode group are larger than the area of the unit electrodes () for the first electrode group. The unit electrodes () for the third electrode group are larger than the area of the unit electrodes () for the second electrode group.

High-frequency thawing apparatus and thawing method with electrodes

A method for manufacturing an electronic component includes the steps of forming an electrode layer including &#x3b1;-tungsten on a substrate at a substrate temperature of about 100&#xb0; C. to about 300&#xb0; C. by a sputtering process, processing the electrode layer so as to have a desired shape, and heat-treating the electrode layer. An electronic component includes a substrate and an electrode layer that is disposed on the substrate directly or indirectly, includes &#x3b1;-tungsten, and has a specific resistance of about 15 &#x3bc;&#x3a9;.cm or less and a warpage of about 120 &#x3bc;m or less. A surface acoustic wave filter includes a piezoelectric substrate and an electrode layer, disposed on the piezoelectric substrate, including &#x3b1;-tungsten.

Method for manufacturing an electronic component

A method of manufacturing a surface acoustic wave element includes the steps of providing a piezoelectric body having an interdigital transducer, where the interdigital transducer is made of a metal having a higher density than the piezoelectric body, and performing ion bombardment of the interdigital transducer and the piezoelectric body simultaneously so as to reduce the thickness of the interdigital transducer and the piezoelectric body.

Method of manufacturing a surface acoustic wave element

A method for producing a surface acoustic wave device, includes the steps of preparing a piezoelectric substrate, forming a thin film electrode on the piezoelectric substrate, etching the thin film electrode for forming an IDT, trimming at least one of the piezoelectric substrate and the IDT to adjust an operation frequency of the surface acoustic wave device, and rapidly altering the surface of the IDT for stabilizing the surface of the IDT.

Method for producing surface acoustic wave device

Method and manufacturing a surface acoustic wave element

A method of preheating a polymer plate by dielectric heating by applying a radio frequency voltage to a laminate in the direction of its lamination through electrodes; a method of producing a laminate, comprising dielectric heating a polymer plate by applying a radio frequency voltage to a laminate in the direction of its lamination through electrodes in a state where the laminate is housed in an annular container encompassing the surfaces of the laminates, and pressing the laminate in the direction of its lamination at least after completion of the application of the radio frequency voltage; and an apparatus for producing the laminate.

Method and apparatus for producing a unified laminated body by dielectric heating and method for dielectrically preheating a laminate structure for the unified laminated body

A prepackaged food sterilizing apparatus for sterilizing a prepackaged food P has a high frequency generator,. A high frequency is supplied from the high frequency generator,to the prepackaged food P to sterilize the prepackaged food P by dielectric heating. The apparatus includes a food loading container,constituted by a pair of opposing electrodes,consisting of a lower electrode,and an upper electrode,to which the high frequency is supplied and an annular insulator,interposed between the opposing electrode pair,. The food loading container,has at least one food loading chamber,in which the prepackaged food P is loaded with an inner shape thereof substantially equal to an outer shape of the prepackaged food P.

Packed food pasteurizing device and pasteurizing method

An object of a high-frequency thawing apparatus is to uniformly thaw an entirety of an article with high efficiency and high-speed, particularly an article having a relatively large thickness. The apparatus is so constructed that a high-frequency power from a high-frequency generating circuit is supplied to a pair of opposing electrodes by way of an impedance matching circuit including a transformer to thaw an article (F) which is carried in between the opposing electrode pair by dielectric heating. The impedance matching circuit includes an electrostatic capacitor section (C) and an inductance section (L). A conductor each constituting the inductance section (L) has such a length that the downstream-located conductor with respect to the transport direction of a conveyor is longer than the upstream-located conductor.

High-frequency thawing apparatus

A heating apparatus for heating a prepackaged food, is provided with a heater which heats a prepackaged food, an enclosure which defines an airtight chamber operable to accommodate the prepackaged food, and a pressure controller which controls the inside pressure of the airtight chamber. The heater includes a pair of electrodes which are arranged face to face, and an electric power source which supplies a high frequency electric power. The inside pressure of the airtight chamber is controlled in response to an expansion of the prepackaged food being heated to prevent the packaging container from breaking out.

Growing community of inventors

Osaka, Japan

Yasuji Yamamoto