Matsushita Electric Industrial Co., Ltd.

Kabushiki Kaisha Nihon Genma

Yasuji Kawashima

Kaoru Shimizu

Mikiya Nakata

Kenichiro Suetsugu

Yukio Maeda

Takashi Nagashima

Toshiaki Ogura

Shunji Hibino

Takeshi Meguro

Shoshi Kabashima

Hiroaki Takano

Sachiho Hayama

Akihiko Matsuike

Tatsuo Okuji

Yasuhiro Morita

Kazuo Nishibori

Hideo Chaki

Flow soldering process and apparatus

A soldering apparatus includes a solder wave shape forming means for melting solder and forming a solder wave shape, and a separating agent dusting means for dusting solder oxides with a separating agent which separates solder and solder oxides. The separating agent is any one selected from the group consisting of offal, cereal grain or flour, bean flour, seed grain or flour, soybean-cake flour, and peanut hull flour, or a combination thereof, as well as an agent and a method of separating solder and solder oxides.

Method for separating solder and solder oxides

A soldering apparatus includes a solder wave shape forming device for melting solder and forming a solder wave shape, and a separating agent dusting device for dusting solder oxides with a separating agent which separates solder and solder oxides. The separating agent is any one selected from the group consisting of offal, cereal grain or flour, bean flour, seed grain or flour, soybean-cake flour, and peanut hull flour, or a combination thereof, as well as an agent and a method of separating solder and solder oxides.

Soldering apparatus and agent for separating solder and solder oxides

A tin-lead alloy solder is provided which exhibits high joint strength under conditions which are likely to induce fatigue fracture. The tin-lead alloy solder comprises 15-80 wt. % lead, 0.1-5 wt. % silver, 0.1-10 wt. % antimony, and 0.0005-0.3 phosphorus, the balance being tin.

Solder

An automatic jet soldering apparatus comprising: a solder bath for holding molten solder therein; a nozzle body having an open top and an open bottom through which the molten solder rises from the solder bath; a punched panel having numerous holes and disposed inside of the nozzle body in such a way to be opened and closed; and a jet source connected to the lower part of the nozzle body, the molten solder rising upward through the nozzle body via the open bottom and the open top of the nozzle body by means of jet power from the jet source. The soldering apparatus further comprises a back rectifying plate mounted on the rear portion of the top opening of the nozzle body, the sloping angle of the back rectifying plate being adjustable, thereby attaining an easy removal of solder residues from the punched panel and achieving a zero relative speed between a printed circuit board and the solder flow velocity, so that the reliability of soldering can be enhanced.

Automatic jet soldering apparatus

Growing community of inventors

Ibaraki, Japan

Yasuji Kawashima