Hamamatsu-Photonics K.k.

Yasuji Hoshino

Yoshihisa Warashina

Hajime Takeyama

Kei Tabata

Masaaki Muto

Shogo Iyama

Takashi Iida

An optical transmitting and receiving module, with which there is no need to provide a submount for disposing a photodiode on a substrate and with which spatial restrictions can be made small, is provided. An optical transmitting and receiving modulehas a light transmitting substrate. A filter grooveis formed on a top surface of light transmitting substrate, and a dielectric multilayer film filteris set in filter groove. An optical fiberand a laser diodeare disposed at opposite positions across dielectric multilayer film filter. Also, a photodiodeis disposed on a rear surface side of light transmitting substrate. Photodiodeis positioned directly below a line connecting optical fiberand laser diode

Optical transmitting /receiving module

An optical wiring board by which an optical waveguide can be easily aligned with a light emitting element and a light detecting element. The optical wiring board () is provided with a substrate (). On the substrate (), a plurality of recessed parts () are formed, and the optical waveguide () is formed between the recessed parts (). In the recessed part (), a light receiving/emitting member (), which is mounted on an inserting part () on a base member (), is arranged. In the inserting member (), reflecting planes () are formed on inclined planes, and an optical path of the optical waveguide () matches with that of a light detecting part () and a light emitting part () in the light receiving/emitting member () via the reflecting planes ().

Optical wiring board and method for manufacturing optical wiring board

An optical module comprises: a sub-mount, having four photodiodesand two guide groovesdisposed on an optical element mounting surface; a fiber fixing member, having four V-grooves, four concave mirrors, and two guide railsdisposed on an optical fiber fixing surface; and four optical fibers, fixed to the fiber fixing member. With this optical module, the sub-mountand fiber fixing memberare aligned and fixed by the fitting together of the guide groovesand guide rails. A passive alignment type optical module that enables mass production and cost reduction is thus realized.

Optical module

The present invention relates to a high-frequency signal transmitting optical module which can easily realize a high-frequency signal transmission by use of a semiconductor optical device to which a highly versatile metal can package has been applied. In the high-frequency signal transmitting optical module, after fixing, to a rear surface of a stem of the metal can package, fixing portions of the linear outer leads by laser welding, the end portions of the outer leads are bent. By this, the outer leads can be easily attached to the semiconductor optical device. On both sides of the respective lead pins of the semiconductor optical device, since the outer leads extending along these are attached to the rear surface of the stem, ground regions are continuously provided on both sides of the respective lead pins by the stem and respective outer leads, whereby TEM wave transmission lines are formed. Accordingly, high-frequency signals can be transmitted to the semiconductor optical device.

High-frequency signal transmitting optical module and method of fabricating the same

In optical modulelight emitted from laser diode (hereinafter referred to as 'LD')is collimated into parallel light beam by ball lensand then travels through ball lensto be focused on coreof optical fiberSince the light passing between ball lensesandis the parallel light beam as described above, allowance is enlarged for axial misalignment between the optical axes of ball lensand ball lensThis enables the light from LDto be focused on coreof optical fibereven if there occurs axial misalignment between the optical axes of optical fiberand LDdue to a factor resulting from fitting of ferruleinto sleeveor the like. Accordingly, there is no need for alignment in a work of mounting optoelectronic devicei.e., LDin housing

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Hamamatsu, Japan

Yasuji Hoshino