Panasonic Intellectual Property Management Co., Ltd.

Panasonic Corporation

Yasuichi Okada

Tadashi Endo

Shozo Fukuda

Noboru Yamasaki

Hirokazu Tanaka

Masahiro Kihara

Minoru Murakami

Kimiyuki Yamasaki

Toshiyuki Murakami

Jun Yamauchi

Shirou Yamashita

Yuki Minamide

Eyri Watari

Makoto Nakashima

Naoto Kohketsu

Masayuki Arase

Tadashi Endou

A component mounter includes a side imaging camera that is provided to be integral with the placing head having a plurality of suction nozzles, that moves relatively with respect to the plurality of suction nozzles, and thereby that images, from a side, peripheral regions of front ends of the plurality of suction nozzles, respectively, in order. Incidentally, a component presence/absence determiner (determiner) determines the presence or absence of a component sucked on the front end of the suction nozzle, based on primary image data obtained by the side imaging camera and the calculator calculates a thickness of the component sucked on the front end of the suction nozzle, based on secondary image data obtained by the side imaging camera.

Component mounter

Image readersA andB that read images of electronic components held by first mounting headsA andB are each configured to have a line sensor arranged at an oblique arrangement angle with respect to a first direction, and in an image acquiring step of selecting any one of a first-directional scanning operation and a second-directional scanning operation is to be conducted by mounting headsA andB based on a predetermined scanning operation selecting condition set in advance, and acquiring image signals from the image readersA andB, image conversion processing of arranging one-dimensional images obtained by converting one-dimensional images sequentially output from the line sensor by an arrangement angle in parallel to generate a two-dimensional image is executed.

Electronic component mounting device and image reading method used by electronic component mounting device

A lower supporting pin moduleis given a shape having a contact surface. On the occasion of position recognition for determining a position of a pin on the lower supporting pin module, an image of the lower supporting pin moduleis captured, and the image is subjected to recognition processing, to thus detect an outer shape of an upper shaftB. Even when an extraneous matter on a downside surface of a substrate adheres to the contact surface, the position of the lower supporting pin modulecan be stably recognized with superior recognition precision.

Lower supporting pin layout determination apparatus and lower supporting pin layout determination method

An imaging part in a screen printing device which images a board and a screen mask includes a single camera which is disposed with a posture of horizontally facing towards an incidence optical axis, a half mirror which makes an imaging light, which is incident through a lower imaging optical axis, to be incident on a camera, and a mirror which makes an imaging light, which is incident through an upper imaging optical axis, to pass through the half mirror and to be incident on the camera, and further has an upper illuminating part and a lower illuminating part which individually illuminate respective imaging objects. Imaging light is taken in the camera in a state that the upper illuminating part and the lower illuminating part are individually operated in a mask imaging step and a board imaging step, respectively.

Screen printing device and an image recognizing method in the screen printing device

A transfer pathway of mounting headsin a component-mounting round during which the mounting headmoves back and forth between a component feeding unitand a substrate conveyance mechanismis derived by a transfer pathway calculation unitfor each component-mounting round from mounting program data. On the basis of data pertaining to the thus-derived transfer pathway, image data output from a line sensor camera assigned to a head transfer range segment that the transfer pathway of the mounting headcrosses in each of component-mounting rounds are selected and captured by an image selection processing unit. The image data output from the line sensor camera whose focusing point substantially matches the imaging target can be used for detecting whether or not a component still exists.

Component mounting apparatus and component detection method

A transfer pathway of a mounting headin a component-mounting round during which the mounting headmoves back and forth between a component feeding unitand a substrate conveyance mechanismis derived by a transfer pathway calculation unitfor each component-mounting round from mounting program data. A focusing processing unitcontrols an optical system focusing mechanism, thereby matching a focusing point of a line sensor cameraachieved during imaging operation to the transfer pathway of the mounting headbased on data pertaining to the derived transfer pathway. Further, an optical system zooming mechanismadjusts an imaging range according to the focusing point. Accordingly, even when a long substrateis taken as an object, it is possible to detect with high precision whether or not a component exists on the pickup nozzleof the mounting head

To provide a lighting device for image capturing in an electronic component mounting apparatus that has small dimensions in the height direction and a small size in a plan view and thus can meet demands in a reduction in size. In an electronic component mounting apparatus, a surface lighting unitthat emits illumination light to a substrate, which is an object whose image is to be captured by a camera, includes as a main component a flat lighting substratethat is provided between the cameraand the substrate, which is an object whose image is to be captured, so as to be substantially parallel to the surface of the substrate. Upper illumination light sources, intermediate illumination light sources, and lower illumination light sourcesare arranged around an openingfor image capturing on one surface of the lighting substratefacing the substrate in this order from the inside to the outside, such that they emit illumination light components to the surface of the substrate at different emission angles. In this way, it is possible to reduce the dimensions of the surface lighting unitin the height direction and thus meet demands for a reduction in size.

Lighting device for image capturing in electronic component mounting apparatus

An electronic component mounting apparatus includes two second linear-motion devices on each of which an image pickup device and a mounting head are placed so as to be movable in an X direction, a first linear-motion device for moving the second linear-motion devices in a Y direction independently of each other, in which the image pickup device is placed at such a position as to be contained within an X-directional width of the mounting head and moreover contained within a Y-directional total width of the mounting head and the second linear-motion device. Thus, since the image pickup region of the camera is contained within the moving region of the mounting head, there is no need for ensuring a moving distance taking into account only the camera's image pickup region, so that the moving-axis length of the second linear-motion devices can be reduced.

Moving device and electronic component mounting

In an image recognition method, the image of a cream solderprinted on a rectangular electrodehaving a solder leveler formed is picked up and recognized to identify the cream solder. An illuminating unit having white light source partsW arranged in the radial oblique directions of 45&#xb0; is used to apply white color illumination lights from a light applying direction in which an angle of &#x3b8;1 formed by the light applying direction and a horizontal plane in a vertical plane is 45&#xb0; or smaller and from a light applying direction in which an angle of &#x3b8;3 formed by the light applying direction and the boundary of the electrodein a horizontal plane is 75&#xb0; or smaller. Thus, regularly reflected lights from a solder leveler forming surfacewith a glossiness are not received by an upper camera to identify a solder surfaceand the solder leveler forming surfacewith good accuracy.

Growing community of inventors

Yamanashi, Japan

Yasuichi Okada