Nitto-Denko Corporation

Yasuhito Ohwaki

Tetsuya Ohsawa

Toshihiko Omote

Hidenori Aonuma

Shigenori Morita

Tadao Ohkawa

Yasuhito Funada

Masayuki Kaneto

Yasunari Ooyabu

Jun Ishii

Shuichi Wakaki

Kenichiro Ito

Tadao Ookawa

Yuichi Takayoshi

Yoshihiko Takeuchi

Makoto Komatsubara

Toshio Shintani

Takeshi Yoshimi

Yosuke Miki

A wired circuit board that can provide an enhanced adhesion of a metal supporting board at a marginal portion of an opening formed in the metal supporting board with a simple structure to prevent stripping of the metal supporting board. In a suspension board with circuit, in order to reduce a transmission loss of a conductive pattern, a metal foil embedded in an insulating base layer is formed in a pattern comprising a first metal foil portion and a second metal foil portion surrounding the first metal foil portion spaced apart therefrom, and an opening is formed in the metal supporting board so that a marginal portion of the opening is located in a space between the first metal foil portion and the second metal foil portion.

Wired circuit board

The present invention provides a catheterhaving a structure wherein an electronic componentis mounted on the anterior end or an intermediate part of a tube, a signal line electrically connecting to the electronic componentextends from the vicinity of the electronic componentthrough the aforementioned tubeto the posterior end of the aforementioned tube, which is characterized in that the signal line consists of a wiring patternof the flexible printed circuit boardinserted in the tube. Consequently, an electronic component-loaded catheter can control increase in the size of the tube caused by multiple signal lines to be connected to the electronic component.

Catheter and production method thereof

A method of producing a suspension board with circuit, wherein after an insulating base layer is formed on a metal supporting board, a conductive pattern including a ground wiring pattern and a signal wiring pattern is formed on the insulating base layer. Then, an insulating cover layer to cover the conductive pattern is formed on the insulating base layer in such a manner that a first cover opening portion and a second cover opening portion are formed in the insulating cover layer. Then, an electrolytic plating layer is formed on a surface of the ground terminal exposed from the first cover opening portion and on a surface of the ground connecting portion exposed from the second cover opening portion, feeding electric power from the ground wire. Thereafter, a metal filling layer is formed in the base opening portion to electrically connect the ground connecting portion and the metal supporting board.

Production method of suspension board with circuit

A flexible wired circuit board for temperature measurement that can provide an accurate temperature measurement even when placed in a high-temperature atmosphere and can also be provided at a reduced cost. In the flexible wired circuit board for temperature measurement, a conductor layer formed from a metal foil, such as a stainless foil, having a proportional relation between temperature and specific electric resistance is formed on a base insulating layer. Also, a single thin sensor wiring in a sensor portion exposed from a cover insulating layer is formed into a certain pattern by folding back the sensor wiring in a continuous S-shaped form, such that adjacent parts of the wiring extending in parallel are spaced apart from each other at a predetermined interval in a widthwise direction of the conductor layer. The flexible wired circuit board for temperature measurement thus constructed can prevent occurrence of errors in measured temperature even when used in high-temperature atmosphere, thus achieving accurate measurement of temperature, different from the flexible wired circuit board having the conductor layer comprising a copper foil.

Flexible wired circuit board for temperature measurement

A wired circuit board that can allow precise connection between wired circuit boards with respect to a direction orthogonal to each other with a simple structure, while allowing reduction in size of the wired circuit boards, and a connecting structure of the wired circuit board comprising two wired circuit boards connected to each other with respect to a direction orthogonal to each other. Relay terminalsof the circuit suspension boardare arranged along one widthwise edge of the circuit suspension board, and terminal cutoutscut in a generally semicircular arc shape from one edge thereof toward an widthwise inside thereof are formed in the relay terminals. In addition, insulating base layer cutoutsare formed in the first insulating base layerto correspond to the terminal cutouts. The circuit suspension boardand a flexible wired circuit board for relayare electrically connected to each other by fitting bumpsformed on suspension terminalsof the flexible wired circuit board for relayin the terminal cutouts

Wired circuit board and connecting structure thereof

A wired circuit board is provided for controlling characteristic impedance at connection points between the read wire and write wire of a suspension board with circuit and terminal portions of the wired circuit board connected thereto. The invention provides improved signal transmission efficiency for fine pitch wiring or for high frequency signal. A conductive board is adhesively bonded to an insulating base layer of the wired circuit board at one side thereof opposite to the other side on which a suspension-board-side connection terminal portion is formed having a first terminal portion that connects with a read wire of the suspension board and a second terminal portion that connects with a write wire of the suspension board. An opening is provided adjacent to one of the first terminal portion and the second terminal portion and a stiffener board is adhesively bonded to the conductive board via an adhesive layer.

Wired circuit board for controlling characteristic impedances of a connection terminal

The present invention provides a flexible printed circuit board having a band-like meandering pattern as a whole, which includes multiple linear parts configured about parallel to each other and a folding margin connected to one end in a longitudinal direction of two adjacent linear parts of the multiple linear parts, and which can turn into a single linear product having a total length of not less than 300 mm when the folding margin is double-folded at about a center thereof, and, at the folding margin, either of the two linear parts connected to the folding margin is folded back in a direction opposite by 180 degrees. As a result, a flexible printed circuit board for a catheter, which is sufficiently elongate for use as a signal line of a catheter, can be produced using a general-purpose production apparatus.

Flexible printed circuit board for catheter, catheter using same, and production method of catheter

The present invention provides a partially completed wiring circuit board assembly sheet capable of preventing deposition of a plating metal on the surface of a metal sheet, even when pinholes are produced in an insulating layer for insulating a lead wire for electroplating from a metal sheet. The assembly sheetof the present invention has a metal sheet, multiple wiring circuit board forming areaA in compartments on the metal sheet and areaB for forming a lead wire for electroplating, which is in compartment on the metal sheet. Each areaA has a partially completed wiring circuit board. The partially completed wiring circuit boardis equipped with a base insulating layer, a wiring patternand a cover insulating layer. In the areaB, a first insulating layer, a lead wirefor electroplating and a second insulating layerare laminated in this order. Of the metal sheet, an openingis formed in the part under the lead wire

Partially completed wiring circuit board assembly sheet and production method of wiring circuit board using said sheet

A production method of a suspension board with circuit that can provide reduced number of man-hour and complicated processes for forming the ground terminal, to provide production cost reduction. An insulating base layerhaving a base opening portionis formed on a metal boardat a ground terminalforming position, and a thin metal filmis formed on the metal boardexposed in the base opening portionand on the insulating base layer. Then, a conductive patternis formed on the thin metal film. Then, an insulating cover layercovering the conductive patternand having a cover opening portionwhich correspond in position to the base opening portionis formed on the insulating base layer. Then, a metal board opening portionfrom which the base opening portionand the insulating base layeraround it are exposed is formed in the metal board. Then, an electrolytic plating layeris formed on each side of the conductive patternexposed in the cover opening portion, feeding electric power from the conductive pattern, and a metal filling layeris formed in the metal board opening portion, to allow the electrolytic plating layerand the metal boardto be conductive with each other.

A wired circuit board is provided having excellent heat radiation characteristics, including when the semiconductor device is mounted on the wired circuit board by the flip chip mounting method. An insulating base layer defines a base opening portion in a mounting region. The base opening portion includes a thin layer portion that surrounds the base opening portion. Inside terminal portions are disposed on the thin layer portion. A heat radiating portion is formed in the base opening region to contact the stiffener sheet As a result, the surface of the inside terminal portion is located lower in level than the surface of the heat radiating portion. Thus, a semiconductor device may be mounted on the wired circuit board by the flip chip mounting method to enable heat generated from the semiconductor device to be transferred to the stiffener sheet via the heat radiating portion.

A suspension board with circuit permits a terminal portion to be formed by electrolysis plating without exposing a conductor layer to outside and a production method thereof. After an insulating base layer is formed on a suspension board in a specific pattern in which a second opening is formed, a thin metal film is formed on the insulating base layer and on the suspension board including the second opening exposed from the insulating base layer. A conductor layer is formed in the form of a wired circuit pattern on the thin metal film. An insulating cover layer is formed with a pad opening therein, and a pad portion formed in the pad opening using the suspension board as a lead portion of the electrolysis plating. A first opening larger than the second opening is formed in the suspension board at a portion thereof corresponding to the second opening.

Suspension board with circuit and producing method thereof

In the vicinity of the exposed partA of the multiply formed plural wiring conductors, of the thicknesses of the insulating cover layermade of a polyimide layer, the thickness (T) of a part located at about the middle point between the adjacent wiring conductorsis made smaller than the thickness (T) of a part located on wiring conductor. Preferably, the difference in the thicknesses of a part located at about the middle point between the adjacent wiring conductors of the insulating cover layerand that of a part located on wiring conductor is made to fall within the range of 1&#x2013;5 &#x3bc;m. As a result, the insulating cover layer does not peel off easily.

Wiring circuit board and production method thereof

A wired circuit board can control characteristic impedance at connection points between wires of a suspension board with circuit and terminal portions of the wired circuit board connected thereto with a simple structure, to improve signal transmission efficiency even for fine pitch wiring or for high frequency signals. The wired circuit board includes a relay flexible wiring circuit board formed by a first wired circuit board including a first metal substrate, a first insulating base layer, a first conductor layer and a first insulating cover layer which is substantially identical in layer structure with the suspension board with circuit and a second wired circuit board connected with the first wired circuit board for connecting with a control circuit board. Since the suspension board with circuit and the first wired circuit board are rendered substantially identical in layer structure, both characteristic impedances at these connection points can be matched.

The present invention provides a production method of a printed circuit board having a circuit pattern with a little variation in the thickness at a low cost without a special step for removal of a dummy pattern. The present invention is characterized in that an insulating layeris formed in a given pattern on one surface of a supporting substrate, a circuit patternis formed on the insulating layerwhile forming a dummy patternin an area free of the insulating layeron the one surface of the supporting substrate, and an unnecessary part of the supporting substrate, which is free of the insulating layerand the circuit pattern, is removed by dissolution together with the dummy pattern

Production method of printed circuit board

In a junction flexible wiring circuit board used for performing junction between a suspension board for mounting a magnetic head of a hard disk drive thereon and a control circuit board for operating the magnetic head, a metal layer is formed on at least one of a surface of an electrically insulating base layer and a surface of an electrically insulating cover layer.

Growing community of inventors

Osaka, Japan

Yasuhito Ohwaki