Matsushita Electric Industrial Co., Ltd.

Yasuhito Kumabuchi

Isao Kidoguchi

Hideto Adachi

Takeshi Uenoyama

Masakatsu Suzuki

Akihiko Ishibashi

Kiyoshi Ohnaka

Satoshi Kamiyama

Toshiya Fukuhisa

Masaya Mannoh

Akira Takamori

Katsuya Nozawa

Minoru Kubo

Toyoji Chino

Makoto Kitabatake

Yorito Ota

Hiroyuki Masato

The semiconductor laser of this invention includes an active layer formed in a c-axis direction, wherein the active layer is made of a hexagonal-system compound semiconductor, and anisotropic strain is generated in a c plane of the active layer.

Semiconductor light emitting element and method for fabricating the same

Si and SiGeC layers are formed in an NMOS transistor on a Si substrate. A carrier accumulation layer is formed with the use of a discontinuous portion of a conduction band present at the heterointerface between the SiGeC and Si layers. Electrons travel in this carrier accumulation layer serving as a channel. In the SiGeC layer, the electron mobility is greater than in silicon, thus increasing the NMOS transistor in operational speed. In a PMOS transistor, a channel in which positive holes travel, is formed with the use of a discontinuous portion of a valence band at the interface between the SiGe and Si layers. In the SiGe layer, too, the positive hole mobility is greater than in the Si layer, thus increasing the PMOS transistor in operational speed. There can be provided a semiconductor device having field-effect transistors having channels lessened in crystal defect.

SiGeC-based CMOSFET with separate heterojunctions

FET having a Si/SiGeC heterojunction channel

A semiconductor device having a single substrate made of silicon carbide; an epitaxial film made of Al,In,Ga,N which is selectively formed on the single substrate; an amplifier section including a gate formed on the single substrate and a source layer and a drain layer which are formed within the single substrate; and another amplifier section formed on the epitaxial film.

Method for forming ohmic electrode, and semiconductor device

A semiconductor laser device, including a substrate; a ridge stripe formed on the substrate and including an active layer, an n-cladding layer and p-cladding layer, the n-cladding layer and the p-cladding layer interposing the active layer; in which the ridge stripe has a laser unit which lases. In one embodiment the ridge stripe has a tip portion having a tapered shape, and an angle formed inside the ridge stripe by a bottom surface of the ridge stripe and a side surface of the ridge stripe is in the range of about 60&deg; and about 90&deg;. In one embodiment, the laser device includes a misoriented substrate and the ridge stripe has current blocking layers formed on both sides thereof.

Semiconductor laser device with ridge structure

Method of forming HCMOS devices with a silicon-germanium-carbon compound semiconductor layer

Semiconductor laser

An etching method for performing dry-etching on a III-V group compound semiconductor or a II-VI group compound semiconductor in a dry-etching apparatus comprising a plasma source for creating a plasma of density of about 10.sup.10 cm.sup.-3 or greater, using a mixed gas containing a gas including a halogen element and a gas including nitrogen. The etching conditions are as follows: (a flow rate of the gas containing said halogen gas)/(a flow rate of said nitrogen gas).gtoreq.1; and an internal pressure during etching reaction is about 1 mTorr or greater.

Method for etching a compound semiconductor, a semiconductor laser

Semiconductor laser and cleaving method

A first metal film and a second metal film, both of which are made of Ni or the like, are deposited on the upper surface of a substrate made of SiC. In such a state, the interface between the first metal film and the substrate and the interface between the second metal film and the substrate both form a Schottky contact. Next, laser light is irradiated from above the upper surface of the substrate only onto the first metal film on the substrate after the diameter of the top end of the laser light has been reduced. Thus, since the metal-semiconductor interface between the first metal film and the substrate is turned into an alloy owing to the energy of the laser light without heating the entire substrate, an ohmic contact can be formed in the interface between the first metal film and the substrate. As a result, an ohmic electrode can be constituted by the first metal film.

Method for forming an ohmic electrode

An etching method for performing dry-etching on a III-V group compound semiconductor or a II-VI group compound semiconductor in a dry-etching apparatus comprising a plasma source for creating a plasma of density of about 10.sup.10 cm.sup.-3 or greater, using a mixed gas containing a gas including a halogen element and a gas including nitrogon. The etching conditions are as follows: (a flow rate of the gas containing said halogen gas)/(a flow rate of said nitrogen gas) .gtoreq.1; and an internal pressure during etching reaction is about 1 mTorr or greater.

Method for etching a compound semiconductor, a semi-conductor laser

An n-type diffusion layer, an insulating layer and a first aluminum electrode are formed on a p-type silicon substrate. Fe.sup.2+ (divalent Fe) having a vacant orbit not filled with an electron is implanted into a region of the insulating layer to form an impurity atom layer. A second aluminum electrode is formed which is in contact with the n-type diffusion layer. A voltage that increases the potential of the first aluminum electrode is applied between the first and second aluminum electrodes. The voltage is increased. In this situation, when the fermi level of the n-type diffusion layer and an impurity level which is the energy level for filling the vacant orbit of the Fe.sup.2+ are matched, a resonance tunnelling current flows. Thereafter, when there is a change to the state of non-resonance state, a negative-resistance characteristic is exhibited in which the current decreases as the voltage is increased. Accordingly, the present invention is able to provide a low-power, low-voltage, fast nonlinear element that can well be incorporated into the integrated circuit, and a bistable memory device employing such an improved nonlinear element.

Growing community of inventors

Toyonaka, Japan

Yasuhito Kumabuchi