Tokyo Seimitsu Co., Ltd.

Yasuhito Iguchi

Yuichi Ozawa

Hiroshi Nishimura

Tetsuo Yoshida

Ken Kato

Seiichi Ohta

Junzo Koshio

Kunihiko Chiba

Akira Yamaguchi

Naoki Kasai

Hiroki Ishida

Yuta Sato

Wataru Kawasaki

Naoyuki Yamazoe

Tetsuya Yasunaka

Teppei Aoki

Kazuma Takii

The wafer test system includes: a prober including a chuck that holds a semiconductor wafer and a probe card having probe needles thereon, and brings the probe needles in contact with semiconductor chips formed on the semiconductor wafer to inspect the semiconductor chips; an overhead hoist transport that delivers the cassette that houses the plurality of semiconductor wafers to be inspected to the prober and withdraws, from the prober, the cassette that houses the semiconductor wafers that have been inspected; a conveying control unit that controls the overhead hoist transport to convey the probe card between a replacement position of the probe card predetermined in the prober and a storage of the probe card located in a place different from the prober; and a card conveying mechanism that conveys the probe card between a holding position in the prober and the replacement position.

Wafer test system, probe card replacing method, and prober

A wafer inspection method improving inspection accuracy and operation efficiency. A method for performing electrical inspection by bringing into contact with pads in chips on a wafer. A chuck step S1 for heating the wafer to an inspection temperature; a first position recognition step S2 for recognizing all the positions of the pads; a second position recognition step S3 for re-recognizing, before performing the electrical inspection, the position of the pads recognizing the positional shifts of the pads due to thermal expansion; and a correction step S4 for correcting contact positions with respect to the probes, the contact positions being corrected on the basis of pad positions, which have been re-recognized in the second position recognition step S3 on the basis of the pad positions recognized in the first position recognition step S2, and which have been updated.

Wafer inspection method

To provide a probing device and a probing method for an electronic device capable of confirming whether or not an electrical inspection has been executed appropriately, with an electrode pad being made in contact with a probe with a predetermined pressure, by utilizing a change in external shapes to be formed on the electrode pad when the probe and the electrode pad are pressed onto each other. The device is provided with a microscopefor image-capturing the electrode pad and for outputting the external shape of the electrode pad as image data, and a control unitwhich stores image data of an external shape of the electrode pad prior to the contact with a probe, and compares the image data of the external shape thus stored with image data thereof after the contact obtained from the microscope, or compares the registered frame of the electrode pad with the outer periphery of the electrode pad detected at the time of inspecting a needle trace, so that the quality of the contact between the electrode pad and the probeis determined.

Probing device for electronic device and probing method

A probe device of the present invention measures a position of every chip in a wafer to be inspected to acquire the position as actual measurement data. Then, the probe device calculates a variation amount of an actual measurement position of each chip or a variation amount of a position at which a probe is brought into contact with the each chip of the wafer on the basis of the actual measurement data, and allows a monitor to display a range-of-variation display image that visually displays the variation amount. In the image, a quadrangular area corresponding to the each chip is displayed, and a dot is displayed in each the quadrangular area at a position shifted from a center position thereof in accordance with the variation amount.

Probe device for testing electrical characteristics of semiconductor element

The present invention provides a probe device that includes an alignment utility function. When a user inputs a condition value for a variation amount (variation range) of a contact position at which a probe is in contact with each chip, in a simulation using actual measurement data acquired by measuring a position of each of all chips in one wafer, a range of variation of each chip is calculated by changing a measurement point at which alignment is performed to calculate a setting of optimum measurement points so that the range of variation is equal to or less than the condition value and the number of measurement points is minimum. Then information on the optimum measurement point is provided to the user.

Alignment support device and alignment support method for probe device

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Tokyo, Japan

Yasuhito Iguchi