Murata Manufacturing Co., Ltd.

Murata Manufacturingco., Ltd.

Yasuhisa Yamamoto

Satoshi Tanaka

Takayuki Tsutsui

Tetsuaki Adachi

Kazuo Watanabe

Ryuken Mizunuma

Masahito Numanami

Isao Obu

Kenji Sasaki

Shota Ishihara

Akiko Itabashi

Masao Kondo

Hideki Ueda

Masashi Omuro

Kazunari Kawahata

Kaoru Sudo

Satoshi Arayashiki

Satoshi Goto

Hiroshi Okabe

Yasunari Umemoto

Yuri Honda

Masahiro Shibata

Takashi Yamada

Yu Ishiwata

Hiroki Shonai

A power amplifier module includes a substrate, an amplifier circuit including a plurality of transistors to be mounted on the substrate and a bump connected to the plurality of transistors, a harmonic termination circuit and an output matching circuit that are disposed in or on the substrate and configured to be electrically connected to the amplifier circuit, a connection pad disposed on the substrate and configured to be connected to the bump, and a plurality of connection wiring lines branching from the connection pad. The plurality of connection wiring lines include at least a first connection wiring line that connects the connection pad and the harmonic termination circuit to each other, a second connection wiring line that connects the connection pad and the output matching circuit to each other, and a third connection wiring line that connects the connection pad and an external power supply to each other.

Power amplifier module

A first antenna, a second antenna, and a waveguide structure are housed in a single cabinet. An operating frequency of the second antenna is higher than an operating frequency of the first antenna. The second antenna is an array antenna including a plurality of radiating elements. The waveguide structure is present outside a range of a half-value angle of a main beam as viewed from the first antenna, includes a unit waveguide disposed in a route of a radio wave received by the second antenna, and further attenuates a radio wave with the operating frequency of the first antenna.

Communication device

A communication network system is a communication network system that distributes information to a plurality of terminals inside a closed space. The communication network system includes a network server and a plurality of lighting fixtures each having an antenna that transmits and receives millimeter-wave-band communication signals to and from the terminals.

Communication network system and lighting fixture

A power amplifier circuit has an input node from which an input signal, which is a high-frequency signal, is inputted and an output node to which the input signal is amplified by a differential amplifier circuit to be outputted as an output signal. The power amplifier circuit includes a balun transformer (second balun transformer) including an input-side winding that has a substantially center to which a power-supply voltage is supplied and that is connected between differential outputs of the differential amplifier circuit, and an output-side winding that is coupled to the input-side winding via an electromagnetic field and that has one end connected to a reference potential; and a capacitive element (capacitor) provided between another end (node) of the output-side winding and the output node.

Power amplifier circuit

On a single-crystal semiconductor substrate with an upper surface including a first direction in which an inverted mesa step extends and a second direction in which a forward mesa step extends in response to anisotropic etching in which an etching rate depends on crystal plane orientation, a bipolar transistor including a collector layer, a base layer, and an emitter layer that are epitaxially grown, and a base wire connected to the base layer are arranged. A step is provided at an edge of the base layer, and the base wire is extended from inside to outside of the base layer in a direction intersecting the first direction in a plan view. An intersection of the edge of the base layer and the base wire has a disconnection prevention structure that makes it difficult for step-caused disconnection of the base wire to occur.

Semiconductor device

A power amplifier circuit includes a power amplifier, first and second filters, and first and second output paths. The power amplifier is able to amplify both of a first signal and a second signal. The frequency of the second signal is higher than that of the first signal. The first filter includes a first inductor and attenuates the second signal amplified in the power amplifier. The first inductor serves as a path for the first signal amplified in the power amplifier. The second filter includes a first capacitor and attenuates the first signal amplified in the power amplifier. The first capacitor serves as a path for the second signal amplified in the power amplifier. The first signal outputted from the first filter is supplied to the first output path. The second signal outputted from the second filter is supplied to the second output path.

A feed line connects an RFIC and a radiating element. A baseband ground plane (BB ground) is connected to a ground terminal of a BBIC. A radio frequency ground plane (RF ground) is placed in such a manner as to overlap the BB ground. The RF ground serves as a return path of the feed line. A first inter-ground connection circuit connects the BB ground and the RF ground. Furthermore, a second inter-ground connection circuit connects the BB ground and the RF ground. Connecting parts between these grounds and the second inter-ground connection circuit are arranged closer to the edges of these grounds than connecting parts between these grounds and the first inter-ground connection circuit. The connecting part between the ground and the second inter-ground connection circuit is placed on one side of a certain imaginary straight line that passes substantially the geometric center of the ground.

Communication module

Provided is a power amplification module that includes: a first transistor, a first signal being inputted to a base thereof; a second transistor, the first signal being inputted to a base thereof and a collector thereof being connected to a collector of the first transistor; a first resistor, a first bias current being supplied to one end thereof and another end thereof being connected to the base of the first transistor; a second resistor, one end thereof being connected to the one end of the first resistor and another end thereof being connected to the base of the second transistor; and a third resistor, a second bias current being supplied to one end thereof and another end thereof being connected to the base of the second transistor.

Power amplification module

A communication terminal capable of at least millimeter-wave communication and microwave communication is provided. The communication terminal includes a repeater that relays communication between a first communication terminal and a second communication terminal by using millimeter-wave communication. Such a communication terminal is capable of maintaining good millimeter-wave communication between terminals.

Communication terminal and communication system

A communication terminal device is a glasses-type communication terminal device having an optically transmissive display mounted thereon. The communication terminal device includes first and second radio-frequency modules that perform radio-frequency signal processing and a baseband module that is connected to the first and second radio-frequency modules via communication lines so as to be communicable and that performs baseband signal processing. The first and second radio-frequency modules are selectively switched by the baseband module to perform a reception operation. When the first radio-frequency module performs the reception operation, a reception signal received by the first radio-frequency module is retransmitted from the second radio-frequency module.

Communication terminal device and communication system

A power amplifier circuit amplifies a radio-frequency signal in a transmit frequency band. The power amplifier circuit includes an amplifier, a bias circuit, and an impedance circuit. The amplifier amplifies power of a radio-frequency signal and outputs an amplified signal. The impedance circuit is connected between a signal input terminal of the amplifier and a bias-current output terminal of the bias circuit and has frequency characteristics in which attenuation is obtained in the transmit frequency band. The impedance circuit includes first and second impedance circuits. The first impedance circuit is connected to the signal input terminal. The second impedance circuit is connected between the first impedance circuit and the bias-current output terminal.

A power supply circuit board includes a substrate, a first line that is provided on a first main surface of the substrate and that has a land, a second line that is provided on the first main surface of the substrate and that has a land, an inductor that is connected to the land of the first line and the land of the second line and that is made of a ferrite material, and an open stub that is connected to at least one of the first line and the second line.

Circuit board, inductor, and radio apparatus

A multi-antenna module includes, on or in the dielectric substrate, a first radiation element, a second radiation element that operates at a frequency band lower than that of the first radiation element, and a ground plane. A first feed line and a second feed line are provided on or in the dielectric substrate. A first switch element switches between a first state in which a signal is supplied to the second radiation element and a second state including at least one of a state in which the second radiation element is connected to the ground plane with terminal impedance interposed therebetween, a state in which the second radiation element is in a floating state with respect to the second feed line and the ground plane, and a state in which the second radiation element is short-circuited to the ground plane.

Multi-antenna module and mobile terminal

Provided is a power amplification circuit that includes: an amplifier that amplifies an input signal and outputs an amplified signal; a first bias circuit that supplies a first bias current or voltage to the amplifier; a second bias circuit that supplies a second bias current or voltage to the amplifier; a first control circuit that controls the first bias current or voltage; and a second control circuit that controls the second bias current or voltage. The current supplying capacity of the first bias circuit is different from the current supplying capacity of the second bias circuit.

Power amplification circuit

An amplifier circuit including a semiconductor element is formed on a substrate. A protection circuit is formed including a plurality of protection diodes that are formed on the substrate and that are connected in series with each other, the protection circuit being connected to an output terminal of the amplifier circuit. A pad conductive layer is formed that at least partially includes a pad for connecting to a circuit outside the substrate. An insulating protective film covers the pad conductive layer. The insulating protective film includes an opening that exposes a partial area of a surface of the pad conductive layer, and that covers another area. A first bump is formed on the pad conductive layer on a bottom surface of the opening, and a second bump at least partially overlaps the protection circuit in plan view and is connected to a ground (GND) potential connected to the amplifier circuit.

Growing community of inventors

Kyoto, Japan

Yasuhisa Yamamoto