Sharp Kabushiki Kaisha Corporation

Yasuhisa Yamaji

Yoshiki Sota

Kenji Toyosawa

Yasunori Chikawa

Yasuki Fukui

Tsukasa Ohishi

This invention is to provide a liquid crystal module that enables a liquid crystal display (LCD) device to be further miniaturized. The liquid crystal module is configured to include at least two LCD devices and formed separately from each other, a first flexible substrate on which a semiconductor chip for driving the LCD devices and is mounted, and a second flexible substrate wherein signal transmission wiring is formed. One of the LCD devices and is electrically connected to the first flexible substrate, the other one of the LCD devices and is electrically connected to the second flexible substrate, and the first flexible substrate is electrically connected to the second flexible substrate.

LCD connected to additional LCD through multiple flexible printed circuit boards

A semiconductor carrier film includes (i) a base film having insulating property, (ii) a barrier layer provided on the base film, the barrier layer including nickel-chrome alloy as a main component, and (iii) a wire layer provided on the barrier layer, the wire layer being made of conductive material including copper, and a ratio of chrome in the barrier layer is 15% to 50% by weight. A semiconductor device is formed by bonding a semiconductor element to the wire layer. The semiconductor carrier film and the semiconductor device are suitable for attaining finer pitches and higher outputs, because insulating resistance between adjacent terminals is less likely to deteriorate then in conventional art even in the environment of high temperature and moisture.

Semiconductor carrier film, and semiconductor device and liquid crystal module using the same

A semiconductor device includes a wiring substrate having wiring and a solder resist for protecting the wiring, which are provided on an insulating substrate, a semiconductor chip which is mounted via the wiring protective film on the wiring substrate on a surface on the other side of the surface on which a circuit is provided to face a side of the wiring substrate on which the wiring is formed, and a wire for electrically connecting the circuit provided on the surface of the semiconductor chip and the wiring of the wiring substrate, and the surface of the solder resist and the semiconductor chip are firmly adhered to each other. In this semiconductor device, because the solder resist and the semiconductor chip are firmly adhered to each other, there arise no bubbles due to a spacing at a portion where the solder resist and the semiconductor chip are bonded with each other. As a result, a crack generated when heating the semiconductor device when installing it in electrical devices can be prevented, and the percent defective can be significantly reduced in a reliability test after bonding is made.

Growing community of inventors

Yamatokoriyama, Japan

Yasuhisa Yamaji