Kyocera Corporation

Yasuhisa Shigenaga

Michiaki Nishimura

A laminated electronic component includes a main body including an effective layer in which dielectric layers and internal electrode layers are alternately laminated, and a pair of a first cover layer and a second cover layer which are disposed on opposite sides, respectively, in a stacking direction of the effective layer; and a plurality of external electrodes disposed on an outer surface of the main body. The internal electrode layers are alternately connected to the different external electrodes, and the first cover layer has a high-Young's modulus layer which is higher in Young's modulus than the dielectric layers. By mounting such a laminated electronic component to a substrate so that the first cover layer and a mounting face of the substrate are opposed to each other, it is possible to suppress acoustic noise.

Laminated electronic component and laminated electronic component mounting structure

A laminated electronic component includes: a rectangular parallelepiped-shaped stacked body including dielectric layers and internal electrode layers which are alternately laminated; and a pair of first conductors and a pair of second conductors which are disposed on an outer surface of the stacked body. The first conductors are disposed in portions which include centers of long sides of a first principal surface which is positioned in a direction of lamination of the dielectric layers and the internal electrode layers of the stacked body, and do not include a vertex of the stacked body so as to extend from first side surfaces to the first principal surface. The second conductors are disposed on second side surfaces, and the first conductors and the second conductors are spaced apart from each other on an outer surface and electrically connected to each other via the internal electrode layers.

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Kirishima, Japan

Yasuhisa Shigenaga