Canon Kabushiki Kaisha

Hitachi, Ltd.

Renesas Electronics Corporation

Fujifilm Healthcare Corporation

Tessera Advanced Technologies, Inc.

Renesas Technology Corp.

Hitachi High-tech Corporation

Hitachi Medical Corporation

Hitachi-lg Data Storage, Inc.

Organo Corporation

Hitachi Printing Solutions, Ltd.

Ricoh Printing Systems Co., Ltd.

Yasuhiro Yoshimura

Hitoshi Suzuki

Takahiro Naito

Naotaka Tanaka

Naoyuki Yamamoto

Takahiro Nakase

Takashi Akazawa

Toshiharu Kondo

Tatsuya Nagata

Michihiro Kawashita

Akifumi Sako

Yasuo Nami

Shuntaro Machida

Yoshishige Endo

Naoaki Yamashita

Takao Terayama

Tokihiko Ogura

Yukiko Ikeda

Masahiro Sato

Yutaka Ito

Hiroshi Mitsumaki

Yasuhiko Sasaki

Ryo Miyake

Hiromitsu Tokisue

Daisuke Ryuzaki

Akira Koide

Naruo Watanabe

Taiichi Takezaki

Jun Nagata

Nobuyuki Ishii

Osamu Narisawa

Sunao Yonekawa

Youichi Inoue

Yasuyuki Horiguchi

Hiroshi Yuyama

Kenji Yasuda

Hiroki Tanaka

Noriyuki Kumasaka

Tetsuo Yokoyama

Hiroshi Ogasawara

Hajime Kato

Katsutoshi Nii

Yoshiaki Yamauchi

Toshihiro Yamada

Yoshihiro Nagaoka

Takashi Yamaguchi

Takeshi Shibuya

Masato Ishizawa

Satoru Yamamoto

Seiichi Katou

Hideaki Amano

Atsushi Kazama

Hiroyasu Uchida

Takanori Aono

Osamu Machida

Toshinari Sakurai

Hiromu Hirai

Ryoji Okada

Tomohiko Koda

Toshiaki Makino

Hisahiro Miki

Satoru Yamaura

Tomonari Morioka

Yutaka Myoki

Yuichi Koizumi

Marutomo Goto

Hideyuki Kimura

Yuko Hanaoka

Yosuke Horie

Tatsuya Yamasaki

Kazuto Oyama

Ayano Otsubo

Kenji Watabe

Takashi Kono

Akio Takatsuka

Naohiro Isobe

Toshio Matsushita

Tomoki Hirata

Makoto Fukada

Haruo Yokota

Noriko Takada

Yoshihiro Satou

Yasuhiko Ishida

Shigehiko Sato

Yui Shioya

A method for purifying an organic solvent has a first treatment of bringing an organic solvent to be treated into contact with an H-type cation exchanger, and a second treatment of bringing a treated liquid from the first treatment into contact with an anion exchanger and an H-type strongly acidic cation exchanger. According to the present application, the provided method and an apparatus for purifying an organic solvent remove metal impurities of both metal species of monovalent and polyvalent metals in the organic solvent.

Method for purifying organic solvent and apparatus for purifying organic solvent

An ultrasonic probe includes a semiconductor chip in which an ultrasonic transducer is formed and an electrode pad electrically connected to an upper electrode or a lower electrode of the ultrasonic transducer is provided and a flexible substrate in which a bump electrically connected to the electrode pad is provided and the bump is disposed in a portion overlapping with a stepped portion of the semiconductor chip. Further, a height of a connection surface of the electrode pad of the semiconductor chip connected to the bump is lower than a height of a lower surface of the lower electrode.

Ultrasonic probe and ultrasonic measurement apparatus using the same

According to one embodiment, an ultrasonic probe includes: an oscillator; a base on which the oscillator is provided; a base conductive wire portion connected to the oscillator; a bump electrode portion supplying a signal to the oscillator via the base conductive wire portion; a pad portion engaging with the bump electrode portion; and an acoustic lens provided such that a force toward the bump electrode portion is applied to the pad portion.

Ultrasonic transmitting and receiving element, and ultrasonic examination device, smartphone, and tablet including the same

Provided is an ultrasonic probe having ultrasonic elements and a printed-circuit board that establishes connection between the ultrasonic elements and external wiring, achieving strong connection between the ultrasonic elements and the printed-circuit board mechanically and electrically, and thereby improving performance in examination and diagnosis using the ultrasonic probe. The printed-circuit board with pads each having a via-hole to be bonded to electrode pads of a chip equipped with the ultrasonic elements, is provided with a reinforcement, in an area of the base material where the pad having the via-hole is not formed. The reinforcement is formed simultaneously with forming the pads and wiring on the printed-circuit board, having the same thickness as the pads. With the reinforcement, pressure is evenly applied to the printed-circuit board when the electrode pad is press-fitted into the pad having the via-hole, thereby preventing warping and deforming of the board.

Ultrasonic probe, and ultrasonic transmitter-receiver system using the same

Provided is an automatic analyzer provided with a liquid level sensing function in which liquid levels in sample containers having various heights can be precisely detected using ultrasonic waves. This device is provided with: a conveyance rack for conveying a sample container which contains a sample and is loaded thereon; a fixed ultrasonic distance sensor for measuring the liquid level position in the sample container loaded on the conveyance rack; sound wave guides for suppressing diffusion of sound waves transmitted from the ultrasonic distance sensor, the sound wave guides being disposed between the sample container and the ultrasonic distance sensor; and a sound wave guide control unit for adjusting the length or switching the length of the sound wave guides in accordance with the distance between the ultrasonic distance sensor and the sample container.

Automatic analyzer

A capacitive micromachined ultrasonic transducerA includes: a silicon substratean insulating filmformed over the silicon substratea lower electrode; insulating filmsanda cavityconstituted by a void formed in a portion of the insulating filman upper electrodeinsulating filmsandand a protective filmIn addition, the insulating filmupper electrodeinsulating filmand insulating filmabove the cavityconfigure a vibration filmand the protective filmabove the vibration filmis divided into a plurality of isolated patterns regularly arranged with a gaphaving a constant spacing formed therebetween.

Capacitive micromachined ultrasonic transducer and ultrasonic imaging apparatus using the same

The present invention addresses the problem of enlarging a sensing area in an ultrasonic probe so as to achieve a higher definition. This ultrasonic diagnostic equipment is provided with an ultrasonic probe that comprises: a CMUT chip () that has drive electrodes ()-(), etc., arranged in a grid-like configuration on a rectangular CMUT element section (); and a CMUT chip () that has drive electrodes ()-(), etc., arranged in a grid-like configuration on the rectangular CMUT element section (), that is adjacent to the CMUT chip (), and in which the drive electrodes ()-() of the adjacent CMUT chip () are electrically connected to the respective drive electrodes ()-() via bonding wires ()-(), etc.

Semiconductor sensor chip, semiconductor sensor chip array, and ultrasound diagnostic apparatus

A structure that prevents a substrate from being warped is provided on a region or a location other than a membrane that determines the characteristics of a CMUT. In a CMUT in a structure in which a first conductive layer and a second conductive layer are provided sandwiching a cavity on a substrate, for example, as a warpage prevention structure, a warpage prevention layer that prevents the substrate from being warped is provided between the substrate and the first conductive film. When the insulating film disposed between the cavity and the first conductive film and the insulating film disposed between the cavity and the second conductive film are silicon oxide films, the warpage prevention layer includes a silicon nitride film.

Ultrasonic transducer, method for making same, ultrasonic transducer array, and ultrasonic test apparatus

An information processing apparatus including an acquisition unit configured to acquire a plurality of vertices forming a one path included in a glyph path, a calculation unit configured to calculate a winding value relating to the one path, a determination unit configured to determine a shift direction of the one path based on the calculated winding value, and a movement unit configured to move positions of the plurality of vertices based on the determined shift direction.

Information processing apparatus, information processing method, and storage medium for transforming path

In order to obtain a high-resolution ultrasound diagnostic image while reducing the back side reflection of a ultrasound irradiated to the side opposite to the ultrasound transmission direction of an ultrasound transmission/reception device, disclosed is an ultrasound probe, wherein a substrate is provided thereon with a cavity, insulation layers having the cavity therebetween, and an upper layer electrode and a lower layer electrode having the cavity and the insulation layers therebetween, so as to form an ultrasound vibration element, the substrate is held by a backing with a low-modulus member therebetween, and a direct voltage and a alternating voltage are applied between the electrodes to vibrate the ultrasound vibration element, and wherein a mechanical impedance by the substrate and the low-modulus member has a substantially equal value as an acoustic impedance of the backing.

Ultrasound probe and ultrasound diagnostic device using same

In an optical module and a scanning-type image display device, a reduction in heat insulating effect due to a natural convection generated between the optical module and a case is suppressed to alleviate laser overheating and thermal expansion or contraction of each component and obtain a stable projection image quality. In an optical module that couples laser beams from a plurality of laser beam sourcesand irradiates the laser beams to a desired position, a cover that covers the optical module is provided, a second cover is provided in a space between the optical module and the cover, and a projecting part is provided on a surface of the second cover facing the optical module.

Optical module and scanning-type image display device

Both controlling damage when assembling an ultrasonic probe using a chip formed with a capacitive ultrasonic transducer and securing operational reliability are achieved. In a semiconductor substrate on which the capacitive ultrasonic transducer (CMUT) is formed on a first primary surface, a protective film is formed on the surface of the ultrasonic transducer which is formed on the first primary surface of the semiconductor substrate which is then thinned by polishing a second primary surface opposite to the first primary surface of the semiconductor substrate, an ultrasonic transducer chip is cutout of the semiconductor substrate, a sound absorbing material is provided on the surface opposite to the surface formed with the ultrasonic transducer, and the protective film formed on the surface of the ultrasonic transducer is removed.

Production method for ultrasonic probe, ultrasonic probe, and ultrasonic diagnosis device

Provided are: an ultrasound probe with excellent characteristic stability; and ultrasound equipment that uses the ultrasound probe. The ultrasound probe has an ultrasonic transmitting and receiving element provided with a substrate, an insulating film formed on the substrate, a cavity formed between the substrate and the insulating film, and a pair of electrodes disposed parallel to the substrate so as to sandwich the cavity. The ultrasound probe is characterized in that the ultrasonic transmitting and receiving element has a beam part with a multilayer structure formed by laminating films made of materials different in stress, the beam part being disposed on the electrode distant from the substrate out of the pair of electrodes, and the beam part is formed by laminating a film that applies tensile stress and a film that applies compressive stress.

Ultrasound probe and ultrasound equipment using same

In a semiconductor device in which a plurality of semiconductor chips are stacked, performance is enhanced without deteriorating productivity. The semiconductor device has a first semiconductor substrate having a first surface and a second surface opposite the first surface, a first insulating film formed on the first surface, a first hole formed in the first insulating film and partially extending into the first semiconductor substrate, a second hole formed in the second surface, a first electrode entirely filling the first hole, and a conductive film conformally formed in the second hole. The conductive film is electrically connected to a bottom surface of the first electrode and leaves a third hole in the first semiconductor substrate open. The third hole is configured to receive a second electrode of a second semiconductor substrate.

Semiconductor device and method of manufacturing same

The communication unit of an information processing apparatus can perform a wireless communication with a terminal apparatus. A state identifier indicating the state of the information processing apparatus is obtained, and a device identifier for identifying the information processing apparatus and the state identifier are transmitted to the terminal apparatus through the communication unit. The terminal apparatus holds additional information corresponding to a state of an information processing apparatus which can be identified by the device identifier, and can display the additional information.

Information processing apparatus capable of communicating with a terminal apparatus, terminal apparatus, and control method thereof

Growing community of inventors

Kasumigaura, Japan

Yasuhiro Yoshimura