Fujitsu Corporation

Nippon Zeon Company, Ltd.

Nitto Chemical Industry Co., Ltd.

Other

Yasuhiro Yoneda

Katsusada Motoyoshi

Tetsuzo Yoshimura

Koji Tsukamoto

Takeshi Ishitsuka

Kishio Yokouchi

Daisuke Mizutani

Akira Tanaka

Wataru Sotoyama

Satoshi Tatsuura

Nobuyuki Hayashi

Teru Nakanishi

Masaru Morita

Yoshikatsu Ishizuki

Toshisuke Kitakohji

Keiji Watanabe

Kei Sakamoto

Shun-ichi Fukuyama

Azuma Matsuura

Tomio Nakamura

Shigeru Shimizu

Kota Nishii

Keiko Yano

Satoshi Tazaki

Masashi Miyagawa

Kenro Kitamura

Takashi Saitoh

Takashi Maruyama

Hideaki Kataoka

Shigenori Aoki

Shigemitsu Kamiya

Masahide Yamamoto

Eiko Yuda

Jiro Naito

Toshihiro Kusagaya

Tomoaki Hayano

Yuji Suwa

Kazuhiko Iijima

Kenroh Kitamura

Tsuyoshi Yamamoto

Ei Yano

Atsushi Suzuki

Takahisa Namiki

Koichi Kobayashi

Masahiko Sugimura

Ryosuke Koishi

Haruhisa Soda

Miwa Igarashi

Yoko Kuramitsu

Yukiko Wakino

Kensuke Yoshida

Yasuo Naganuma

Masashi Takada

Kenichi Ito

Ren Ishikawa

Shigeru Tomisawa

Masami Koshiyama

A semiconductor device includes: a wiring board including a first electrode pad on a surface thereof; a circuit board disposed to stand on the wiring board, and including an interconnection connected to the first electrode pad; and a semiconductor package disposed to face the wiring board with the circuit board interposed therebetween, and including a second electrode pad on a surface thereof, the second electrode pad being connected to the interconnection.

Electronic device

Electronic component

Semiconductor device

An electronic device includes a wiring board including a first electrode and a second electrode, a semiconductor device mounted on the wiring board and including a first terminal and a second terminal, an interposer provided between the wiring board and the semiconductor device, the interposer including a conductive pad and a sheet supporting the conductive pad, the conductive pad having a first surface on a side of the wiring board and a second surface on a side of the semiconductor device, a first solder connecting the first electrode positioned outside of an area in which the interposer is disposed with the first terminal positioned outside of the area, a second solder connecting the second electrode positioned inside of the area with the first surface of the conductive pad, and a third solder connecting the second terminal positioned inside of the area with the second surface of the conductive pad.

Electronic device, interposer and method of manufacturing electronic device

An electronic device includes a wiring board; a semiconductor device arranged at an upper side of the wiring board with an electrically conductive member being arranged therebetween; a covering member arranged at an upper side of the semiconductor device; and a supporting member arranged at a lower side of the wiring board, the supporting member having a convex portion facing the wiring board, the supporting member being connected to the covering member and supporting the wiring board at the convex portion.

Electronic device and method of producing the same

An electronic device includes an electronic component mounted on a substrate; a cooling system for cooling the electronic component; and a fastening structure for fastening the cooling system to the substrate. The fastening structure includes a first magnet provided to one of the substrate and the cooling system, a second magnetic material fixed to the other of the substrate and the cooling system and magnetically coupled with the first magnet, and a magnetic shield that covers a part or all of the first magnet except for a coupling face to be coupled with the second magnetic material.

A measuring method of a battery includes the step of measuring frequency characteristics of an internal impedance of the battery by an AC impedance method, and determining a parameter of an element representing ease of mobility of charges on a surface of a positive electrode of the battery and that of an element representing the ease of mobility of charges on the surface of a negative electrode.

Method of measuring characteristics regarding safety of battery

An inexpensive multilayer wiring circuit board capable of conducting high frequency switching operation on the circuit while the generation of high frequency noise is being suppressed by reducing the inductance of the circuit in provided. A multilayer wiring circuit board with an uppermost layer designated as a first layer on which parts are mounted; a second layer on which one of a ground layer and an electric power source layer is arranged; a third layer on which the other is arranged; and an insulating layer arranged between the ground layer and the electric power source layer. A resin layer having a thermoplastic adhesion property on both faces is used as material of the insulating layer arranged between the electric power source layer and the ground layer.

Multilayer wiring circuit board

An inexpensive multilayer wiring circuit board capable of conducting high frequency switching operation on the circuit while the generation of high frequency noise is being suppressed by reducing the inductance of the circuit in provided. A multilayer wiring circuit board comprising: an uppermost layer designated as a first layer on which parts are mounted; a second layer on which one of a ground layer and an electric power source layer is arranged; a third layer on which the other is arranged; and an insulating layer arranged between the ground layer and the electric power source layer. A resin layer having a thermoplastic adhesion property on both faces is used as material of the insulating layer arranged between the electric power source layer and the ground layer.

The present invention is aimed to provide a head suspension having a high resonant frequency, high shock resistance and low rigidity, which greatly contributes to an improvement of a magnetic disk apparatus. In an oscillation-type actuator, at least a part of a spring arm of the head suspension having a data reading/writing head slideris made of an anisotropic layer whose rigidity varies in accordance with a direction. In this case, the anisotropic layer is laminated so that the high rigidity modulus orientation direction is different according to layer.

Head suspension for swing arm actuator

A polyimide resin composition comprising a polyimide resin (A) and at least one 1H-tetrazole (B) selected from the group consisting of 1H-tetrazole, 5,5&prime;-bis-1H-tetrazole, and derivatives thereof, and having an excellent rust preventing effect on copper and copper alloys.

Polyimide film

Pattern forming process using polyimide resin composition

An optical circuit system which takes out at least a portion of the light of a light power source corresponding to at least one type of output voltage of an IC, board, multichip module, electronic element, or opto-electronic element and produces an optical signal, wherein the light power source is an optical waveguide into which light has been introduced, a waveguide laser, or a waveguide optical amplifier, light reflecting portions are provided at its ends and/or middle, a signal transmission waveguide is formed in contact with the side surface and/or top or bottom surface of the optical waveguide or in proximity to the same at a certain distance, and the optical signal corresponding to at least one type of output voltage of the IC, board, multichip module, electronic element, or opto-electronic element is made to propagate to the signal transmission waveguide, which optical circuit system is rich in flexibility and enables complicated optical interconnections to be handled, and components of the same.

Optical circuit system and components of same

Developer for photosensitive polyimide resin composition

An optical circuit device is manufactured by forming an organic film formed on a substrate, and giving this organic film non-linear optical properties. An optical circuit device is formed containing an organic film formed on a substrate, wherein said film is either selectively formed on a portion of the region on a substrate or said film being formed over the entire region on a substrate, and a portion of a region of that film is either selectively formed to a thickness differing from other regions or selectively having a different structure. This optical circuit device can be manufactured to have various constitutions, and allows the formation of a multilayer optical circuit.

Optical circuit device, its manufacturing process and a multilayer optical circuit using said optical circuit device

Growing community of inventors

Kawasaki, Japan

Yasuhiro Yoneda