Denso Corporation

Nippondenso Co., Ltd.

Yasuhiro Yamashita

Masao Kano

Wataru Kobayashi

Yukihiro Kato

Nobukazu Oba

Seiichirou Ootake

Eiji Hayashi

Kyutaro Hayashi

Tadashi Kunou

A semiconductor device includes: a semiconductor element; a case; a terminal made of a conductive material and embedded in the case, a part of the terminal being exposed to the outside, having an outermost surface that includes a first film, and having a base portion; a bonding wire that is connected to the first film and electrically connects the semiconductor element and the terminal; and a protection member that is more flexible than the case and covers a contact portion of the terminal contacting with the bonding wire. The first film is removed from an area around the contact portion with the bonding wire in the part of the terminal being exposed to the outside, causing the base portion to be exposed. An exposed portion of the base portion and the protection member adhere to each other.

Semiconductor device

A semiconductor device includes a Zener diode connected between an outside terminal and ground, and a resistor connected to the Zener diode in series. The Zener diode and the resistor divide a noise voltage, so that the semiconductor device can have the high noise tolerance even if it uses the small Zener diode.

Semiconductor device for protecting a circuit formed on a semiconductor chip from destruction caused by an electrostatic discharge

A pressure sensor has a case having a first side and a second side, and a sensing portion mounted to the case. A first diaphragm is disposed on the first side of the case such that a first chamber is defined. A second diaphragm is disposed on the second side of the case such that a second chamber is defined. The first chamber and the second chamber are filled with a pressure medium such as an oil. The case forms an introduction passage for introducing the pressure medium into the first chamber and the second chamber. In a condition that the first chamber and the second chamber are filled with the pressure medium, the introduction passage is sealed by a sealing part so that the first chamber and the second chamber are separated from each other and from an outside of the case.

Pressure sensor

A pressure-changing device of a leak check system for a fuel vapor treatment system has a pressure chamber formed in a peripheral space of a communicating path connecting a pump with an electromagnetic valve, the pressure chamber being deviated from flow delivered by the pump. The electromagnetic valve is opened to connect the communicating path with a canister. Then, a purge valve is closed and the pump is turned on to change pressure in a fuel vapor path. A pressure sensor attached on a side wall of the pressure chamber detects pressure in the communicating path to determine pressure in the fuel vapor path. The leak check system judges existence of leak in the fuel vapor treatment system from pressure in the fuel vapor path.

Fuel vapor treatment system

A pressure sensor device having a temperature sensor includes a pressure sensor, a temperature sensor, a sensor casing for accommodating the pressure sensor and a connector pin for electrically connecting the pressure sensor to an outside circuit, and an inlet port mounted on the sensor casing and having a pressure introduction port for introducing a measuring object to the pressure sensor. The temperature sensor comprises a temperature sensing element and a pair of lead wires and is disposed in the pressure introduction port. The lead wires of the temperature sensor are welded to and supported by the connector pin. One of the lead wires is formed as a U-shape and inserted into the pressure introduction port while the U-shaped lead wire is inwardly depressed, so that a reaction force is generated at the lead wire, which outwardly urges the lead wire and the temperature sensing element to an inner wall of the pressure introduction port. As a result, the temperature sensor is firmly fixed to the sensor device of a smaller size and a vibration of the temperature sensor can be suppressed.

Pressure sensor device having temperature sensor

A brake hydraulic pressure detector includes a bridge circuit made up of a semiconductor sensor which generates a detection voltage in accordance with hydraulic pressure and resistors for setting the detection voltage during nonbraking to a nonzero predetermined voltage, an adder circuit for amplifying and generating the detection voltage from the bridge circuit by a predetermined gain, and an output circuit. Here, if the sensitivity of an output voltage with respect to the hydraulic pressure varies, i.e., if the gain varies for some reason, the output voltage during nonbraking also changes because the offset voltage is set to a nonzero voltage. Thus, abnormality in the sensitivity of the brake hydraulic pressure detector can be detected by monitoring the output voltage during nonbraking.

Growing community of inventors

Nukata-gun, Japan

Yasuhiro Yamashita