Ibiden Company Limited

Yasuhiro Watanabe

Michimasa Takahashi

Masakazu Aoyama

Takenobu Nakamura

Hiroyuki Yanagisawa

This invention provides a multilayer printed wiring board in which electric connectivity and functionality are obtained by improving reliability and particularly, reliability to the drop test can be improved. No corrosion resistant layer is formed on a solder padB on which a component is to be mounted so as to obtain flexibility. Thus, if an impact is received from outside when a related product is dropped, the impact can be buffered so as to protect any mounted component from being removed. On the other hand, landA in which the corrosion resistant layer is formed is unlikely to occur contact failure even if a carbon pillar constituting an operation key makes repeated contacts.

Multilayer printed wiring board and manufacturing method of multilayer printed wiring board

A method of manufacturing multilayer printed wiring hoard in which electric connectivity and functionality are obtained by improving reliability and particularly, reliability to the drop test can be improved. In the inventive method, no corrosion resistant layer is formed on a solder pad on which a component is to be mounted so as to obtain flexibility. Thus, if an impact is received from outside when a related product is dropped, the impact can be buffered so as to protect any mounted component from being removed. On the other hand, a land in which the corrosion resistant layer is formed by the method is unlikely to occur contact failure even if a carbon pillar constituting an operation key makes repeated contacts.

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Ogaki, Japan

Yasuhiro Watanabe