Zeon Corporation

Yasuhiro Wakisaka

Kei Sakamoto

Yasuo Tsunogae

Kazunori Taguchi

Hitomi Takeuchi

A process for producing a multilayer printed wiring board, comprising providing an uncured or partly-cured resin layer from a curable composition comprising an insulation polymer and a curable agent, the resin layer superimposed on an internal layer substrate having a first conductive layer as an outermost layer; bringing the surface of the resin layer into contact with a compound having a structure capable of coordination with a metal; curable the resin layer to thereby form an electrical insulation layer; oxidizing the surface of the obtained electrical insulation layer until the surface average roughness (Ra) of the electrical insulation layer falls within the range of 0.05 to less than 0.2 &#x3bc;m and the surface ten-point average roughness (Rzjis) thereof within the range of 0.3 to less than 4 &#x3bc;m; and forming a second conductive layer on the electrical insulation layer by plating operation. There is further provided a multilayer printed wiring board produced by the process. This multilayer printed wiring board excels in pattern adhesion to substrates, even those of large size.

Process for producing multilayer printed wiring board

A ring-opened metathesis copolymer and its hydrogenated product having a desired monomer unit ratio and a high molecular weight and having hydroxyl groups or hydroxycarbonyl groups can be obtained by conducting a ring-opening metathesis copolymerization of a norbornene-type monomer having hydroxyl groups or hydroxycarbonyl groups with an unsubstituted norbornene-type monomer having at least three rings in the presence of a catalyst predominantly comprised of an organic ruthenium compound having coordinated therewith a neutral electron-donating ligand, and, if desired, hydrogenating the resulting copolymer. The thus-obtained ring-opened metathesis copolymer and its hydrogenation product are characterized by having a low water absorption, good adhesion to metal and other materials, good compatibility with a curing agent and other compounds, and high heat resistance, and exhibiting reduced signal retardation and signal noise.

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Tokyo, Japan

Yasuhiro Wakisaka