Ricoh Company, Ltd.

Nec Corporation

Hitachi Construction Machinery Co., Ltd.

Nikko Rica Corporation

Japan Fine Steel Co., Ltd.

Yasuhiro Tani

Toshiyuki Enomoto

Yutaka Shimazaki

Hiroyuki Endo

Yoshiyuki Sato

Isao Ishikawa

Hisayoshi Sato

Shigeru Inoue

Yukinobu Tokunaga

Kazumasa Tsuchihashi

Makoto Hiyamizu

Takuya Semba

A call control system performs call control for a terminal which accesses different radio access network systems. A communication exchange processing apparatus includes: a device storing maximum bandwidth for specified calls processed in the radio access network system; a device measuring present bandwidth for specified calls presently processed in the radio access network system; a device computing a ratio of the present bandwidth to the maximum bandwidth for specified calls; and a device sending specified call band ratio information indicating the ratio of present bandwidth to maximum bandwidth for specified calls to a radio network control apparatus in the radio access network system and connected to the present communication exchange processing apparatus. The radio network control apparatus provided in the radio access network system includes a device sending the specified call band ratio information to a terminal which is connected to the present radio network control apparatus by radio communication.

Call control system and call control method

There is provided a fixed abrasive wire having abrasives fixed thereon with a superior fixing strength. The abrasives are fixed on the wire by electroplating in which the wire is subjected to a degreasing step, an acid cleaning step, a rinsing step and an electroplating step sequentially. A plating liquid used in the electroplating step contains a nickel-containing organic acid or a nickel-containing inorganic acid, a leveling agent, and the abrasives. It is a feature that a plated coat being over the top of each of the abrasives has a smaller thickness than a theoretical value.

Fixed abrasive wire

A processing tool is used to carry out a fixed-abrasive grinding process on a surface of a silicon work-piece. The processing tool includes abrasive grains made up silica grains. A primary average grain size of the silica grains is desirably 0.8 nm to 10 &mgr;m.

Processing tool, method of producing tool, processing method and processing apparatus

An abrasive wire provides an efficient cutting operation with high accuracy and a longer service life. Abrasive grains are provided around a core wire. The abrasive grains are bonded to the core wire by a light curing resin or an electron beam curing resin which can be cured within a few seconds. Accordingly, the curing operation can be performed while the core wire is moved in the direction of the longitudinal axis of the core wire. Thus, a long abrasive wire can be fabricated at reduced time and cost.

Abrasive wire for a wire saw and a method of manufacturing the abrasive wire

An electrolytic in-process dressing method, an electrolytic in-process dressing grinding apparatus, and an electrolytic in-process dressing grindstone, for grinding workpiece as the grindstone is being subjected to electrolytic in-process dressing, are provided, in which the grindstone is made of abrasive grains and a binding material which is capable of forming a uniform and fine passive layer at the grinding surface thereof and also capable of preventing excessive elusion of the binding material, thereby preventing the formation of chips at the ground surface in the course of grinding operation.

Electrolytic in-process dressing method, electrolytic in-process

Electrolytic in-process dressing method, electrolytic in process

A probe for an ultrasonic microscope is disclosed. The probe has an element for radiating and receiving an ultrasonic wave and an acoustic lens for causing an ultrasonic wave, which has been generated by the element, to converge at a point into an ultrasonic beam, whereby the ultrasonic beam is radiated against a sample and a reflected wave of the thus-radiated ultrasonic beam is received by the element to convert the reflected wave into an electrical signal proportional to the reflected wave. A mask is provided on a side of the sample relative to the acoustic lens. The mask is composed of an ultrasonic wave transmitting portion and an ultrasonic wave blocking portion. The transmitting portion permits the transmission of first beam components, which take part in producing an elastic surface wave in one direction in a surface layer of the sample, and second beam components which take no part in the production of any elastic surface wave. The blocking portion substantially reduces the transmission of third beam components, which take part in producing elastic surface waves in directions other than said one direction in the surface layer of the sample.

Probe for ultrasonic microscope

The vacuum chuck, which is an accessory device for holding a workpiece in machining and inspection, has a suction head made of a porous sintered particles of a thermoplastic resin, e.g., a fluorocarbon resin, preferably, bonded to the chuck base. The suction head is free from the problem of unreliableness of holding of workpieces without the danger of damaging the workpiece. The outer peripheral surfaces of the sucking head are provided with an air-impermeable layer to increase the efficiency of suction by preventing leakage of vacuum. The water-and-oil-resistance of the suction head can be improved by blending the powder of the thermoplastic resin with a powder of a thermosetting resin, e.g., epoxy resin.

Growing community of inventors

Tokyo, Japan

Yasuhiro Tani