Kureha Corporation

Rohm and Haas Company

Yasuhiro Suzuki

Kazuyuki Suzuki

Yoshikichi Teramoto

Naomitsu Nishihata

Takumi Katsurao

Hideki Kitamura

Tsukasa Ikeda

Atsuhiro Higuchi

Kenichi Iwabuchi

A semiconductive film formed from a resin composition comprising poly(ether ether ketone) and a conductive filler, wherein the average value of its thickness is 30 to 250 &#x3bc;m, the maximum value of the thickness is 1 to 1.3 times as much as the minimum value thereof, the average value of its volume resistivity is 1.0&#xd7;10to 1.0&#xd7;10&#x3a9;cm, the maximum value of the volume resistivity is 1 to 30 times as much as the minimum value thereof, and the number of reciprocating folds as determined in accordance with the testing method for folding endurance is at least 5,000 times, and a production process thereof.

Semiconductive film, electric charge control member and process for producing the semiconductive film

Polyvinylidene fluoride resin powder for melt molding, which exhibits such particle size distribution characteristics that the average particle diameter (D) is 80 to 250 &#x3bc;m, the proportion of resin powder having a particle diameter of at most 45 &#x3bc;m is at most 15.0% by weight, and the proportion of resin powder having a particle diameter of at least 355 &#x3bc;m is at most 10.0% by weight, and has a bulk density of 0.30 to 0.80 g/cmand an angle of repose of at most 40&#xb0;, and a process for producing a molding, which comprises feeding the resin powder to an injection molding machine or extrusion molding machine, melting the resin powder, and injecting the resin melt into a mold.

Polyvinylidene fluoride resin powder for melt molding and process for producing molding from the resin powder

A powdery linear polymer having a narrow particle size distribution with little dusting and excellent in anti-blocking property is recovered from a latex of a linear polymer containing a large proportion (35&#x2013;75 wt. %) of soft polymer (S) component through a two-step coagulation process including a first (moderate coagulation) step causing 70&#x2013;98 wt. % of the coagulation. The linear polymer in the latex has a multilayer structure comprising a linear polymer (S) having a glass transition temperature below 40&#xb0; C. and a linear polymer (H) having a higher glass transition temperature disposed in totally at least two layers and containing 35&#x2013;75 wt. %, as a whole, of the linear polymer (S) with the proviso that the linear polymer (S) cannot be contained in excess of 30 wt. % in an outermost layer of the multilayer structure.

Process for producing powdery linear polymer having improved powder properties

Growing community of inventors

Fukushima, Japan

Yasuhiro Suzuki